Home » Products

IS410

Epoxy Laminate and Prepreg
High Thermal Reliability / Fast Cure / Lead-free

IS410 is a high-performance FR-4 epoxy laminate & prepreg system designed to support the printed circuit board industry's requirements for higher levels of reliability and the trend to lead-free solder.

Isola's IS410 has a Tg of 180 degrees C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288 degrees C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of less than or equal to 10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs. Along with these attributes, IS410 brings improved productivity with its fast cure system while using current fabrication techniques.

IS410 is especially suited for broadband, networking equipment.

Performance and Processing Advantages

• High Thermal Performance
  Tg of 180 degrees C (DSC)
  Superior performance through multiple thermal excursions
  -Passes 6X @ 288 degrees C
• Fast Cure
  Unique chemistry increases throughput with reduced press time
• CAF Resistant
  Supports small feature size pcb designs
  Improves long-term circuit board reliability in the field
• Enhanced Drilling Performance for High Aspect PTH
  Greater than 10 to 1 aspect ratio
  Optimized for drilling small holes (less than 10 mils)

Purchasing Information

• Industry Standard
  IPC-4101C /24, /26, /28, /121, /124, /129
  UL Recognized - FR-4, File Number E41625
  (Part of Isola's FR-4 Family)
• Standard Availability
  Thickness: 0.002" [.05 mm] to 0.125" [3.2 mm]
  Available in sheet or panel form
  Copper Foil Cladding: Grade 3 (HTE), 1/8 to 3 oz.
  Foil Options: Double treat, reverse treat
  Prepregs: Available in roll or panel form
  Glass Styles: 106, 1080, 2113, 2116, 1652 and 7628