P95 & P25
Supporting Literature
Tech Docs
Mechanical Properties
Tech Bulletin Lead Free Procedures
Processing Guide
Polyimide Process Guide.pdf
MSDS
P25 Prepreg MSDS.pdf
P95 Laminate MSDS.pdf
Product Bulletin
P95 & P25 Bulletin.pdf
Polyimide Laminate and Prepreg
Isola Laminate Systems offers a product line or polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications. These products consist of a flame resistance, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. They utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Performance and Processing Advantages
- High Tg - 260 degrees C (TMA)
Greater thermal performance over epoxy-bismaleimide blends - Maintains Bond Strength at High Temperature
- Tough Resin System
Improved processing due to less brittleness
Less declamination from machining - Non-brominated Chemistry, Thermally Stable Laminate System
Full benefits of 100% polyimide performance - Non-MDA (Methylene Dianiline) Chemistry
Meets all OSHA 1910.1050 requirements
Purchasing Information
- Industry Approvals
IPC-4101C /41 /40 /42
UL Recognized - GPY, File Number E41625 - Standard Availability
Thickness: 0.0025" [.05 mm] to 0.125" [3.2 mm]
Available in sheet or panel form
Copper Foil Cladding: Grade 3 (HTE), 1/2, 1 and 2 oz.
Foil Options: Double treat, Copper-Invar-Copper
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2113, 2116, and 7628
