Dura Flex -- Europe Only at this time

Supporting Literature

Product Bulletin
DURA FLEX

DURAFLEX-E-Cu DURAFLEX-E-Cu is an epoxy based, lead adhesiveless, semi-flexible laminate which can replace well-known flexible base materials like Polyester and Polyimide. Typical applications for DURAFLEX-E-Cu are rigid-flex PCBs or bend to assembly designs where dynamic bending characteristics are not required. Besides the high flexibility DURAFLEX-E-Cu has a Tg at  150 C (DSC). Using our new developed I-Fab glass fabrics we were able to improve significantly the flexural strength (up to factor 2.5) compared to conventional fabric types. Its endurance bending strength has been verified in several test series: After 3x lead free reflow the base material has been bended with a radius of 2 mm in an angle of 180. DURAFLEX-E-Cu is available as laminate and prepreg. Epoxy based it can be proc-essed with standard process parameters (relamination as well as PCB manufacturing process). DURAFLEX-E-Cu does not need an adhesive layer to the copper foil which helps to avoid many problems in the PCB manufacturing process.