Tech Papers
- 2/28/2008 Drum Side Treat Foil DSTF Presentation
This paper highlites DSFT copper/laminates advantages as well as list licensed users. - 3/5/2007 Signal Integrity Considerations in High-Reliability Designs
- 11/1/2006 RF Power Handling
- 10/19/2006 GETEK Product Module
- 5/1/2006 An Assessment of the Impact of Lead-Free Assembly Processes
- 5/1/2006 ELIMINATING CAF
- 5/1/2006 High-Wire Act
- 5/1/2006 Improved High Speed, Low Loss Materials
- 5/1/2006 Lead Free Assembly:
- 5/1/2006 Reengineered FR-4 Base Materials
- 5/1/2006 Thermal Analysis of Base Materials
- 2/19/2006 The Effect of Processing, Glass Finish, and Rheology on the
- 5/10/2005 New UL Listing Info
- 1/28/2005 Lead-free Soldering A Challenge For Base Materials
- 2/24/2004 Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
- 2/24/2004 Signal Integrity Analysis Techniques used to Characterize PCB Substrates
- 4/9/2003 Development of Printed Circuit Board Systems through Improved Resin Matrix
- 4/1/2003 Component Specific PCB Registration Characterization
- 4/1/2003 Process Specific PCB Thickness Modeling
- 3/27/2002 Conductive Anodic Filament Failure
