Join Isola in Booth 219 at EDI CON 2015
April 14-16, 2015
EDI CON 2015 moves to CNCC to Accommodate Growth
Organizers of the Electronic Design Innovation Conference (EDI CON) have signed a contract with the China National Convention Center (CNCC) to host this industry-driven event for RF, microwave and high speed digital electronic designers on April 14-16, 2015 in Beijing, China. The venue change is necessary to accommodate the expected growth in the number of vendors participating in the exhibition next year. The success of the event this past April, which included record attendance and a sold out exhibition, led to the decision to move the event to the larger, newer facility.
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
Join Isola in booth 219 on the exhibition floor.
Registration information can be found at http://www.ediconchina.com/registration.asp.