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Isola 2016 Fact Sheet

Isola to Host EIPC and IPC Workshop on April 30th

EIPC and IPC Announce Roadshow Workshop

April 25, 28 and 30

IPC and EIPC are working together to bring educational workshops to Europe in 2014. During April, Dr. Martin Anselm, Universal Instruments Corporation, will present two half-day workshops in the UK and Germany on failure analysis and reliability testing. Dr. Anselm is a frequent lecturer at IPC events and has consistently been rated as one of IPC's best instructors. Sign up for one or both workshops.

April 25, Enthone, Woking, United Kingdom
April 28, Bus Elektronik, Riesa, Germany
April 30, Isola GmbH, Düren, Germany

Workshop 1
April 25, 28 or 30
9:00 am-12:00 pm
Failure Analysis: Lessons Learned
Dr. Martin Anselm, Universal Instruments Corporation

INTERMEDIATE
When reviewed in conjunction with research, failures provide a unique perspective on design for manufacturability and reliability. This course will provide valuable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies. Design considerations for advanced assembly processes and analytical techniques for materials characterization will also be covered. In addition, a review of lead-free laminate selection and testing procedures will shed some light on the question, "Can your board withstand 9x reflow?" Participants are encouraged to bring specific questions or examples of surface mount process difficulties to be shared in open discussion at the end of the course.

Agenda

  • Major difficulties in lead-free reliability testing
  • Mixed alloy assembly best practices
  • ENEPIG intermetallic formation morphologies
  • PCB plating considerations
  • Analytical testing techniques
  • Root causes of production failures
  • Failure analysis studies - fine-pitch printing, PoP, 01005 defects, and high Tg laminate failures

Workshop 2
April 25, 28 or 30
1:30 pm-4:30 pm

Reliability Testing of Intermetallic Fragility on ENIG upon Addition of Limitless Cu
Dr. Martin Anselm, Universal Instruments Corporation

INTERMEDIATE TO ADVANCED
As reliability requirements increase, the need to characterize components used in electronics assemblies also increases. OEMs and EMS companies look to perform characterizations early in the process to limit quality-related issues and improve both assembly yields and device reliability. With the use of BGA devices, higher stress conditions, RoHS-compatible materials and increased package densities tend to cause premature failures in intermetallic layers. Therefore, it is necessary to have quantitative and qualitative test methodologies to address these interfaces.

Although solder ball shear tests or pull-testing on unassembled BGA devices provide useful data for the component manufacturer, they do not fully represent the final assembly in terms of metallurgical condition. Specifically, when BGA components using a nickel-gold surface finish are soldered to PCBs with a copper-based pad (e.g., Cu-OSP, ImmAg, ImmSn or HASL), additional copper dissolves into the solder joint, affecting the intermetallic structure of the ENIG pad. Because current mechanical solder ball testing procedures on unassembled BGA devices do not accurately duplicate the condition of this intermetallic structure, test results on ENIG pads will not necessarily correlate to actual manufacturing reliability.

This course will present data on the intermetallic strengths and failure modes of two bond pull-test methods: hot bump pull (HBP) and cold bump pull (CBP) testing will be compared, where Cu is added by the copper pins of the HBP tester or by Cu power in a second reflow followed by CBP testing.

Who Should Attend These Workshops?
Those involved in printed board design, assembly and bare board fabrication. Special emphasis will be placed on the integration of material selection, bare board fabrication and assembly as related to enhancing long-term reliability of printed boards subjected to lead-free assembly.

Registration Fees
Attending one workshop, lunch not included:
€225 per person (EIPC or IPC members); €275 (nonmembers)

Attending both workshops, lunch included:
€350 per person (EIPC or IPC members); €425 (nonmembers)
Additional members from the same company will receive a 20 percent registration discount.

Download the Workshop Registration Form

For more information about the agenda or other matters, please contact EIPC, kwestenberg@eipc.org.