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Isola 2016 Fact Sheet

Blog: Boards, Chips and Packaging: Hardware Takes Center Stage

Boards, Chips and Packaging: Hardware Takes Center Stage

Written by Tarun Amla, Executive VP & CTO at Isola as featured in Electronics Purchasing Strategies

Today’s electronic products have become so sophisticated and ubiquitous that we have come to expect that each new generation will address both our current and future needs. Years ago, the industry was hardware-centric and driven by “big iron” products. Capacity and functionality were thoroughly dependent upon increasingly complex hardware. Think of the movies of the 50s where “high tech” data was encoded on paper cards that were then fed into a massive bank of computers. Then move to the current, often-cited technology fact that an iPhone has more computing power in it than the technology that took the Apollo astronauts to the moon.

As an industry, we have moved from saying, “Hey, look at what we can do for you” to responding to the much more user/customer-centric demand of “This is what we want/need, when can you build it?” In most instances, increases in capacity and functionality have been the result of software innovations — operating systems and applications that can do almost anything you can think of and need and some that you may never need. Today, the limitations are assumed to be lack of imagination, never of capability.

But, as today’s electronic products continue to evolve, the role of hardware is moving back towards the center stage. Hardware may never again be the star, but it will always be the all-important supporting cast. Or, more accurately, hardware is the solid foundation upon which all electronic products are dependent in order to continually deliver more functionality and complexity.

At the Isola Group, we live at the core of this foundation. Further, we, like all hardware suppliers, are hard-pressed to keep pace with technology demands. We are constantly fine-tuning the properties of the laminates we deliver to the industry. Factors of which consumers and end users are rarely aware ─ such as low loss and skew-free materials, GaN devices that go as high as 170°C, and the use of multiscale engineering techniques in the design process ─ are becoming commonplace.

These, collectively, are the gauntlet that has been thrown down to suppliers of hardware technology so that we can keep pace with evolving software capabilities. This course of evolution will only continue. The most important element in the equation is that the hardware industry, as a whole, needs to focus on a more collaborative approach to hardware design and product development. Material, board, and chip and packaging developers are realizing that the best path to fully functioning hardware is achieved through comprehensive and all-encompassing product development methodologies that are best addressed from a systems integration point of view.

The impetus of this integrated approach to hardware design will only grow in importance through the coming years. Products that are often considered “cool technology gadgets” today are becoming “life enhancement” products that are an integral part of our being, and, in many instances, influence the direction of our lives and how we live them. Longer life expectancies fuel a growing segment of the population wherein people not only survive but thrive and live independently as long as possible.

From medical monitoring to life assistance devices, autonomous driving innovations to communication devices and entertainment products, this long-term need for quality of life needs to be addressed by the electronics industry as it meets the demands of a constantly and rapidly evolving technology landscape. What we as an industry must do is focus our attention such that hardware and software function are integral elements that successfully address the needs of this highly tech-dependent ecosystem.

About the Author
Tarun Amla is the Executive VP and Chief Technology Officer for Isola Group, a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multi-layer printed circuit boards. Along with Semico Research, Isola Group is launching a new Semico Impact Conference, Boards, Chips and Packaging: Designing to Maximize Results which will be conducted October 13, 2015 at the Computer History Museum in Mountain View, California. At this event, key topics that will be addressed include: how do we get to next generation high speed data transfer rates; how can the design process for chips, boards and packages be managed to optimize product development; autonomous driving: the role of mm wave automotive radar; and more. For more information regarding topics and speakers please visit www.semico.com.