Isola Introduces Halogen-Free, Ultra-Low Loss Materials for High-Speed Digital, RF and Microwave Applications
New TerraGreen™ laminates and prepreg materials for multilayer PCBs are ideal for high-layer count, high-speed digital, backplanes and hybrid designs.
CHANDLER, Ariz., September 25, 2013 — Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced today TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.
TerraGreen has a full offering of cores and prepreg utilizing spread-glass fabric. The dielectric constant (ranging from 3.00 to 3.45) and dissipation factor (ranging from 0.0030 to 0.0035) remain stable over a wide range of frequencies and temperatures. Core thicknesses from 0.002” to 0.018”, 0.020”, 0.030” and 0.060” are available.
TerraGreen is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen is suitable for high-layer count, high-speed digital, backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.
Tarun Amla, Executive Vice-president and Chief Technology Officer at Isola, stated, “Electronics manufacturers have long-expressed the need for halogen-free, ultra-low loss, lead-free assembly material for high-speed digital and RF/microwave markets. Isola’s investments in R&D have successfully resolved this issue with our proprietary TerraGreen resin system.”
To learn about this new product, please visit http://www.isola-group.com/products/terragreen/.
A high-resolution press photo can be downloaded from http://bit.ly/1dEMgjZ.