CHANDLER, ARIZONA, September 16, 2008 - Isola USA Corporation ("Isola"), demanded that TUC respect the R.O.C. invention patent No. 123529 entitled "Fillers for Improved Epoxy Laminates" immediately cease all acts that would infringe on the patent, including but not limited to manufacturing the products with the Nos. TUC662 and TUC752 (including the final products and the semi-products) by themselves or through any third party, offering to sell, selling, or using the said products. Isola also filed an Injunction in the ROC Intellectual Property Court to prohibit TUC from manufacturing the products with the Nos. TUC662 and TUC752 (including the final products and the semi-products) or any other products that infringe the above R.O.C. invention patent No. 123529 by themselves or through any third party, or offering to sell, selling, using, exporting or importing the said products.
"Isola, and its predecessors, have always had a history of product innovation. The patent on filled material is just one of several innovations that have demonstrated Isola's commitment to being the leader in technology. Our strategy is very simple, innovate and then protect our investment," stated Ray Sharpe, CEO of Isola Group.
Legislative changes have restricted the use of lead in electronics for environmental and health reasons prompting original equipment manufacturers, as well as contract manufacturers, PCB fabricators and material suppliers, to design PCBs that use new lead-free alloys. These new alloys, however, have the drawback of requiring higher assembly temperatures in the range of 20-40 C higher than previous lead-containing PCBs.
This transition to lead-free materials has required prepreg and laminate manufacturers such as Isola to develop new base materials that can withstand the necessary high assembly temperatures. Isola became a pioneer in this area by developing base materials that used phenolic-cured resin chemistry. Isola held a patent on this technology until it expired in 2003. While the phenolic-cured chemistry solved the higher assembly temperature problem, new problems arose, including the problem of thermal expansion that is associated with the thermal cycling of newly developed PCBs.
To avoid the problems of thermal expansion, resin based PCBs and the base materials (prepregs and laminates) used to fabricate the PCBs need to have a low z-axis coefficient of expansion so that the differential stresses in the plated through holes and interconnects between the copper and the base material can be reduced, thus reducing circuit failures.
"To address the thermal expansion problem, Isola's research team pioneered the development of another class of "industry standard" high performance base materials. Such materials include Isola's 370HR, 250HR, IS400, IS420 and DE104i laminate and prepreg products that use an inorganic filler, covered by the patent/s," stated Tarun Amla, Vice President and Chief Technology Officer, Isola.