Are you bored with your board?
Rajan Bedi's recent Out-of-this-World Design blog in EDN talks about how the performance required to deliver the next generation of satellite services for operators is stretching the capability of traditional materials used to fabricate space-grade PCBs. Ka-band, RF carriers, broadband ADCs/DACs, noisy switching regulators, low-voltage high-current FPGAs containing multi-gigabit, high-speed serial links, as well as I/O toggling around 1 GHz, all now reside on the same PCB separated by only a few centimetres. The choice of dielectric now has to optimise for RF, analog, and digital requirements. Read more.