This year’s Electronica fair in Munich started for us with a technology seminar. Augusto Meozzi, President Europe, invited technologists from Siemens and specialists from PCB industry to attend the seminar.
Ray Sharpe, CEO Isola Group, presented an overview on global Isola activities.Subsequently Dr. Demmer, CT Siemens, reported on “Innovative Packaging today and tomorrow”. The next presentation by A. Meozzi was a market overview for Europe, followed by “Developments on glass substrates for high performance pcbs” by M. Scari of Isofab. Wolfgang Alberth, Isola Europe, completed the program with a presentation on the current Isola product portfolio, product applications and latest base material developments.
The seminar closed with a discussion session.