Metal Clad Substrates
Metal Clad Substrates (MCS) are thermally conductive base materials for temperature-sensitive applications. The combination of a copper-clad dielectric and an aluminum carrier delivers effective heat dissipation and provide a great alternative to active cooling methods and thick film techniques. In addition to its high thermal conductivity, MCS, which is currently offered to our European customers, provides very high thermal and mechanical reliability.
Based on the configuration of the MCS construction and its efficient heat dissipation, construction pitches can be reduced and increased power density can be achieved, allowing for smaller assemblies that are hard to realize with conventional base materials.
Typical applications of MCS include high-power LED modules, converters, automotive electronics, heat-sink circuits and industrial electronics.