Product List.
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I-Speed® IS
I-Speed® IS is a product extension of I-Speed. The low Dk glass significantly reduces the Dk of the material to allow increased trace widths and also reduces skew caused by Dk differences between the glass and resin.
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FR408HRIS
FR408HRIS laminate and prepreg products are manufactured with Isola’s patentable high performance multifunctional resin system, reinforced with electrical grade (low Dk) glass fabric.
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I-Speed®
I-Speed® is a proprietary high-performance 180°C (DSC) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
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FR408HR
FR408HR is a proprietary high-performance 230°C (DMA) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
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IS620i
IS620i is the first material in the digital products class built upon existing technologies, yet offering significant advantages for today’s digital world. The resin matrix of IS620i is uniquely formulated for high-speed applications ranging from 2 to 15 GHz, providing a low, flat loss response over the entire range.
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FR408HR BC
FR408HR BC is a proprietary high performance 230°C (DMA) glass transition temperature (Tg) FR-4 system for multilayer printed wiring board (PWB) applications where maximum thermal performance and reliability are required.
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FR408
FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.
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IS415 BC
Isola’s IS415 BC sets the industry standard for high thermal performance epoxy materials and is ideally suited for designs requiring high signal integrity.
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IS415
IS415 sets the industry standard for high thermal performance epoxy materials and is ideally suited for designs requiring high signal integrity.
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IS680-280
IS680-280 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
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GETEK®
GETEK® materials provide the low dielectric constant (Dk) and low dissipation factor (Df) performance demanded by high speed, low loss Printed Wiring Board (PWB) designs and applications, while providing superior thermal performance and high reliability based on the systems 180°C glass transition temperature (Tg).