A11
Tg 100, Td 300
Dk 4.5, Df 0.033
/20
Isola offers a family of No-Flo Prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
A11 products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
Key Features
Minimal, Uniform Resin Flow
- Complete encapsulation and embedment of no-planar surfaces
- Consistent dielectric spacing
Thermal Performance
- General-purpose epoxy – 100°C Tg
Adhesion to Wide Range of Materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper
- Plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Industry Approvals
- IPC-4101C /20
- UL Recognized – FR-4, File Number E45456
- Qualified to UL’s MCIL Program
Processing Ease
- Machinable to complex shapes by steel rule die and punching
- Allows for lamination at non-uniform pressures
- Cure and forms bond at low temperatures
Availability
- Glass Styles: 104, 108
- Available in 38″ rolls or paneled forms
Other styles and roll widths are available upon request
