ALL PRINTED CIRCUIT MATERIALS

Isola Laminates & Prepreg

Isola’s high-performance laminate materials feature proprietary resin formulations engineered to satisfy the most demanding performance criteria in complex circuit boards used in the most demanding electronic equipment.

Our laminate and prepreg materials are used in a variety of advanced electronics, including network and communications equipment and high-end consumer electronics, as well as advanced automotive, aerospace, military and medical applications. Demand in these markets is driven by the rapid growth of bandwidth-intensive high-speed data transmission, the expansion of the internet, the emergence of cloud computing and the evolution of increasingly complex communications technology. These trends have led to an urgent need for the development of the underlying infrastructure to support this growth, including faster and more efficient semiconductor technology. In addition, increasingly pervasive environmental regulations are driving a need for lead-free compatible, high-performance laminate materials.

ProductCTE Z-axisTg
by TMA
TdDkDf
185HR2.71803404.010.0200
2543.41503404.300.020
370 TURBO®3.51753404.100.022
370HR2.81803404.040.0210
A11N/A1003004.500.033
Astra® MT772.92003603.000.0017
DE1044.21353154.370.022
DE1562.81553904.000.02
ED130UVN/A135N/A4.350.017
FR4024.21403204.250.015
FR4063.51703003.930.0167
FR406NN/A1703004.30.025
FR4083.51803603.670.0120
FR408HR2.81903603.680.0092
G2003.301803253.700.013
I-Speed®2.71803603.640.0060
I-Tera® MT402.82003603.450.0031
I-Tera® MT40 (RF/MW Applications)2.82003603.450.0031
IS300MD1.61903903.060.0033
IS4003.31503303.900.022
IS400HR3.01503304.200.016
IS4103.51803503.970.02
IS4152.82003703.720.0120
IS4202.81703504.040.021
IS620i2.82253643.580.006
IS6802.92003602.80-3.450.0025-0.0035
IS680 AG2.92003603.00 / 3.38 / 3.450.0020 - 0.0026
P25N--2503833.670.0187
P95/P251.52604163.760.017
P96/P261.52603963.760.017
Tachyon® 100G2.51853803.020.0021
TerraGreen®2.92003903.440.0039
TerraGreen® (RF/MW Applications)2.92003903.440.0039

Webinars, Videos & Articles

PCB Material Selection for RF, Microwave and Millimeter-wave Design (Presentation)

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost (Presentation)

This presentation discusses the following:
- Printed Circuit Board (PCB)
- Requirements for Operation in mmWave Frequency Band
- Requirements for Automotive Safety Systems
- Available Materials
- Case Study: Automotive RADAR

Understanding Glass Fabric (Presentation)

This presentation defines and compares the types of glass fabrics available.

New Thermoset PCB Material Emerging for mmWave Applications (Article)

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

Stack-up and routing optimization by understanding micro-scale PCB effects (Technical Paper)

This paper presents an experimental, numerical, and analytical investigation of the important role that micro-scale PCB effects play in defining the characteristic impedance of interconnects, the associated attenuation and phase constant, and the appearance of resonances in the insertion and return loss.

Thermosets' Cost and Reliability Advantages for Automotive Radar PCBs (White Paper)

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Fire Retardancy What, Why and How (White Paper)

The paper takes a critical look at all aspects of fire retardancy, starting with the need for fire safety.

Utilizing Thermal Fatigue Testing to Differentiate the Performance of Epoxy Materials at Various Glass Transition Temperature Levels (Technical Paper)

This paper discusses Interconnect Stress Testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect.

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing (Technical Paper)

This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.

The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards (Technical Paper)

This paper shows how small sets of designed experiments can be used to create a compensation model.

Standardizing a Test Method for Conductive Anodic Filament Growth Failure (Technical Paper)

This paper discusses a standard test vehicle design and test method, CAF analysis and board manufacturing.

Roughness Characterization for Interconnect Analysis (Technical Paper)

This paper discusses the electrical characterization of roughness effect for analysis of digital and microwave signal propagation in rough PCB interconnects.

Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance (Technical Paper)

This paper discusses the continuing evolution of FR-4 base materials.

Process-specific PCB Thickness Modeling (Technical Paper)

This paper discusses a method to design a thickness prediction model for a specific board shop process.

Predicting Dimensional Deformation During Lamination for Multilayer Printed Circuit Boards (Technical Paper)

This paper describes a model that helps predict the dimensional movement as a function of CTE’s and moduli of the constituent layers and as a function of the lamination temperature.

PCB Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements (Technical Paper)

This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates (Technical Paper)

This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

Moisture Absorption Properties of Laminates Used in Chip Packaging Applications (Technical Paper)

This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.

Micro-sectioning of Laminates (Technical Paper)

This paper describes how micro-sectioning can be an extremely useful technique to inspect PCBs.

Making Sense of Laminate Dielectric Properties (Technical Paper)

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

Lead Free Assembly: A Practical Tool For Laminate Materials Selection (Technical Paper)

This paper defines a “best practice” methodology to be used in determining selection criteria for lead-free assembly materials.

Laminate Materials with Low Dielectric Properties (Technical Paper)

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Laminate Materials for No-Lead Solder Applications (Technical Paper)

This paper discusses the development of resin systems that withstand the higher reflow temperatures required of lead-free solders, while offering ease of fabrication processing and providing cost competitive solutions in today’s global marketplace.

Signal Integrity Analysis Techniques Used to Characterize PCB Substrates (Technical Paper)

This paper explores several methods used characterize PCB substrate electrical performance.

Improved High Speed, Low Loss Materials for Lead-Free Assembly Compatibility (Technical Paper)

This paper comparesa the properties of a low Dk, low Df material with an existing low Dk, low Df material in widespread use.

High Tg Bromine-free Laminates for PWB Applications (Technical Paper)

This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

Halogen Free Base Materials for PWB Applications (Technical Paper)

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

Control of Key Registration Variables for Improved Process Yields on Dense MLBs (Technical Paper)

This paper explains the sources of registration error and outlines a path for improving process yield.

Conductive Anodic Filament Growth Failure (Technical Paper)

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

COATED COPPER FOILS FOR HIGH DENSITY INTERCONNECTS (Technical Paper)

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Characterizing Geometry-Dependent Crossover Frequency for Stripline Dielectric and Metal Losses (Technical Paper)

This paper discusses how digital signaling requires interconnects operating at microwave frequencies to achieve current data transfer demands in computing platforms.

Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis (Technical Paper)

This paper will discuss how certain statistical analysis techniques may be used to decipher the results, and predict capabilities of PCB materials and/or processes.

New Developments in High Frequency Dielectric Measurements of PWB Materials Part II: Applications of the Bereskin Method to PWB Materials (Technical Paper)

This paper discusses how a relatively easy and repeatable technique is presented for measuring the Dielectric Constant and Dissipation Factor (Dk/Df) of PWB materials for frequencies in the range of 1.5 GHz to 12 GHz.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions (Technical Paper)

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability (Technical Paper)

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

A High Power GaN-HEMT Power Amplifier at 2.4 GHz (Technical Paper)

This paper presents the design, implementation and measurement of a high efficient GaN-HEMT power amplifier working at 2.4 GHz.

Understanding Glass Transition Temperature Measurements of Printed Circuit Boards by DSC (Application Note)

This application note discusses how Differential Scanning Calorimetry (DSC) measures the flow of heat into or out of a sample compared to a reference.

Stress Voids: Distorted Internal Pads After HASL (Application Note)

This application note discusses how stress voids are a widespread condition not always recognized for what they are, how they are formed and how to eliminate them.

Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics? (Article)

This article discusses how technology is changing the automotive industry.

Thermal Analysis of Base Materials Through Assembly (Article)

This article discusses if current analytical techniques predict and characterize differences in laminate performance prior to exposure to thermal excursions during assembly?

Signal Integrity Considerations in High-Reliability Designs (Article)

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

Developments in Glass Yarns and Fabric Constructions (Article)

This article discusses how the process of glass fibre production remained largely unchanged over 50 years, however there have been a number of recent important developments that have enabled substrates made with woven glass fabrics to adapt to the changing requirements of circuit design.

CAF Resistance of NON-DICY FR-4 (Article)

This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

Thermal Management of PCBs in Embedded Systems (Presentation)

This presentation discusses thermal management considerations for embedded systems.

SITV’s Stack-ups and Loss (Presentation)

This presentation outlines SITV stack-ups general, loss characterization and balancing resin content.

Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model (Presentation)

This presentation outlines practical fiber weave effect model for skew and jitter.

PIM in PCBs: Mechanisms & Mitigation (Presentation)

This presentation describes the sources & physical mechanisms of PIM in communication systems.

PCB Material Selection for High-speed Digital Designs (Presentation)

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Passive Intermodulation (PIM) in PCBs (Presentation)

This presentation the sources of Passive Intermodulation in PCBs and how to measure it.

Modelling Skew and Jitter Induced by Fiber Weave Effect in PCB Dielectrics (Presentation)

This presentation describes a practical fiber-weave effect model to mitigate skew.

Meeting Flame Resistance Requirements for Green Electronics (Presentation)

This presentation discusses challenges and opportunities for halogen-free laminates.

Material & Process Influences on Conductive Anodic Filamentation (CAF) (Presentation)

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction (Presentation)

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? (Presentation)

This presentation describes smeared resin, hole debris and post separation ICDs.

Sequential Lamination in Printed Circuit Boards (Application Note)

This application note addresses the mechanical issues of this technology, when it is used on thicker boards.

Prepreg Selection: Individual Dielectric Space (Application Note)

This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.

Multilayer Lamination: Vacuum Frames (Application Note)

This application note discusses a common method of introducing vacuum lamination to a facility that has a well-functioning hydraulic lamination press is to use “vacuum frames.”

Calculated Thickness vs. Measured Thickness (Application Note)

This application note describes the overall thickness nedded to achieve and monitor the effectiveness of process changes intended to realize less taper in your panels.