A11

No-Flo® Specialty Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
100°C
Td
300°C
Dk
4.50
Df
0.033
IPC-4101 - /20
UL - File Number E41625
The A11 family of no-flow prepregs consists of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.

A11 products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

Product Attributes

Typical Market Applications

  • There are no typical market applications.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Processing Advantages
    • Complete encapsulation of non-planar surfaces
    • Cure and form bond at low temperatures
    • Allows for lamination at non-uniform pressures
    • Adhesion to wide range of materials
    • Flex films – (Mylar®, Kapton®, etc.)
    • Treated or untreated copper
    • Plated metals (tin, solder, nickel, etc.)
    • Conventional laminate surfaces

Product Availability

  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass

Production & Manufacturing

  • Currently manufactured in North America
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Pressed Thickness
A. 104
B. 1080 (108 for A11)
2.0
3.7
mm (mil)
Resin Content
A. 106
B. 1080 (108 for A11)
75
65
%2.3.16.2
Resin Flow Testing
A. 104
B. 1080 (108 for A11)
22.3.17
Modified Circle Flow
A. 104
B. 1080 (108 for A11)
0.010 - 0.100mm (mil)
Glass Transition Temperature (Tg) by DSC100°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss300°C2.4.24.6
Cure Temperature Recommended for Full Cure171
Min. for Functional Bonding149
Z-Axis CTE80ppm/°C2.4.24C
X/Y-Axis CTE18/16ppm/°C2.4.24C
Thermal Conductivity0.25W/mKASTM E1952
Dk, Permittivity@ 1 GHz4.52.5.5.9
Df, Loss Tangent@ 1 GHz0.0332.5.5.9
Dielectric Breakdown80kV2.5.6B
Peel Strength1 oz. EDC foil9.0N/mm (lb/inch)2.4.8C
Flammability (Laminate & laminated prepreg)HBRatingUL 94
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
03/16/2017
01/04/2016
10/16/2012

Webinars, Videos & Articles

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

If you have any questions about A11, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in A11.

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