No-Flo® Specialty Prepreg
|Thermal Performance||Electrical Performance||Industry Approvals|
UL - File Number E41625
The A11 family of no-flow prepregs consists of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
A11 products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
Typical Market Applications
- There are no typical market applications.
- UL File Number: E41625
- RoHS Compliant
- Complete encapsulation of non-planar surfaces
- Cure and form bond at low temperatures
- Allows for lamination at non-uniform pressures
- Adhesion to wide range of materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper
- Plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
Production & Manufacturing
- Currently manufactured in North America
|Property||Typical Value||Units||Test Method|
|Metric (English)||IPC-TM-650 (or as noted)|
|Resin Flow Testing|
|Modified Circle Flow|
|0.010 - 0.100||mm (mil)|
|Glass Transition Temperature (Tg) by DSC||100||°C||2.4.25C|
|Decomposition Temperature (Td) by TGA @ 5% weight loss||300||°C||22.214.171.124|
|Cure Temperature Recommended for Full Cure||171|
|Min. for Functional Bonding||149|
|Thermal Conductivity||0.25||W/mK||ASTM E1952|
|Dk, Permittivity||@ 1 GHz||4.5||—||126.96.36.199|
|Df, Loss Tangent||@ 1 GHz||0.033||—||188.8.131.52|
|Peel Strength||1 oz. EDC foil||9.0||N/mm (lb/inch)||2.4.8C|
|Flammability (Laminate & laminated prepreg)||HB||Rating||UL 94|
|The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.|
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We thank you for your interest in A11.