Halogen Free

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

This presentation discusses the following:
- Printed Circuit Board (PCB)
- Requirements for Operation in mmWave Frequency Band
- Requirements for Automotive Safety Systems
- Available Materials
- Case Study: Automotive RADAR

This presentation defines and compares the types of glass fabrics available.

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

This paper presents an experimental, numerical, and analytical investigation of the important role that micro-scale PCB effects play in defining the characteristic impedance of interconnects, the associated attenuation and phase constant, and the appearance of resonances in the insertion and return loss.

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

The paper takes a critical look at all aspects of fire retardancy, starting with the need for fire safety.

This paper discusses Interconnect Stress Testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect.

This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.

This paper shows how small sets of designed experiments can be used to create a compensation model.

This paper discusses a standard test vehicle design and test method, CAF analysis and board manufacturing.

This paper discusses the electrical characterization of roughness effect for analysis of digital and microwave signal propagation in rough PCB interconnects.

This paper discusses the continuing evolution of FR-4 base materials.

This paper discusses a method to design a thickness prediction model for a specific board shop process.

This paper describes a model that helps predict the dimensional movement as a function of CTE’s and moduli of the constituent layers and as a function of the lamination temperature.

This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.

This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.

This paper describes how micro-sectioning can be an extremely useful technique to inspect PCBs.

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

This paper defines a “best practice” methodology to be used in determining selection criteria for lead-free assembly materials.

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

This paper discusses the development of resin systems that withstand the higher reflow temperatures required of lead-free solders, while offering ease of fabrication processing and providing cost competitive solutions in today’s global marketplace.

This paper explores several methods used characterize PCB substrate electrical performance.

This paper comparesa the properties of a low Dk, low Df material with an existing low Dk, low Df material in widespread use.

This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

This paper explains the sources of registration error and outlines a path for improving process yield.

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

This paper discusses how digital signaling requires interconnects operating at microwave frequencies to achieve current data transfer demands in computing platforms.

This paper will discuss how certain statistical analysis techniques may be used to decipher the results, and predict capabilities of PCB materials and/or processes.

This paper discusses how a relatively easy and repeatable technique is presented for measuring the Dielectric Constant and Dissipation Factor (Dk/Df) of PWB materials for frequencies in the range of 1.5 GHz to 12 GHz.

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

This paper presents the design, implementation and measurement of a high efficient GaN-HEMT power amplifier working at 2.4 GHz.

This application note discusses how Differential Scanning Calorimetry (DSC) measures the flow of heat into or out of a sample compared to a reference.

This application note discusses how stress voids are a widespread condition not always recognized for what they are, how they are formed and how to eliminate them.

This article discusses how technology is changing the automotive industry.

This article discusses if current analytical techniques predict and characterize differences in laminate performance prior to exposure to thermal excursions during assembly?

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

This article discusses how the process of glass fibre production remained largely unchanged over 50 years, however there have been a number of recent important developments that have enabled substrates made with woven glass fabrics to adapt to the changing requirements of circuit design.

This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.

This presentation describes the process of laminate and prepreg manufacturing.

This presentation discusses thermal management considerations for embedded systems.

This presentation outlines SITV stack-ups general, loss characterization and balancing resin content.

This presentation outlines practical fiber weave effect model for skew and jitter.

This presentation describes the sources & physical mechanisms of PIM in communication systems.

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

This presentation the sources of Passive Intermodulation in PCBs and how to measure it.

This presentation describes a practical fiber-weave effect model to mitigate skew.

This presentation discusses challenges and opportunities for halogen-free laminates.

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

This presentation describes smeared resin, hole debris and post separation ICDs.

This application note addresses the mechanical issues of this technology, when it is used on thicker boards.

This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.

This application note discusses a common method of introducing vacuum lamination to a facility that has a well-functioning hydraulic lamination press is to use “vacuum frames.”

This application note describes the overall thickness nedded to achieve and monitor the effectiveness of process changes intended to realize less taper in your panels.