High Density Interconnect
High Density Interconnect (HDI) attributes are printed circuit board designs that employ increased feature density to achieve lighter weight, reduced layer count, and thinner stack ups.
HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products. Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we incorporate square weaves, spread glass technology that improves laser ablation consistency, critical feature registration, and dielectric thickness control. We offer our ultrathin glass fabrics down to 1/2 mil (0.02 mm) for many of our high performance products. With these glass styles, Isola provides a glass reinforced 1.0 mil (0.04 mm) laminate that improves composite structure rigidity and array registration when compared to unreinforced solutions.
- Multiple resin systems – High Tg, lead-free, high speed digital, RF, halogen-free
- Hybrid capability
- Wide range of RC% prepregs
- Ultrathin glass styles – 1027, 1035, 1078, 1067, 1086
- Square weave and spread glass
- Ultrathin glass reinforced laminate down to 0.04 mm or 1 mil
- Personal Electronics
- Military and Aerospace
- Layer Count Reduction
- Sequential Lamination
Webinars, Videos & Articles
This paper explains the sources of registration error and outlines a path for improving process yield.
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.
This presentation describes smeared resin, hole debris and post separation ICDs.