Polyimide

Iosla Polyimide

Isola offers a  product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.These products consist of a flame resistant, polyimide‑resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.

Isola’s materials utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Features:

  • Greater thermal performance over competitive products with very high epoxy content
  • Maintains bond strength at high temperature
  • Durable resin system
  • Improved processing due to less brittleness
  • Less delamination from machining
  • Meets all OSHA 1910.1050 requirements
  • Halogen-free product offering
  • RoHS Compliant
  • UL – File Number E41625
Applications:

  • Military
  • Aerospace
  • Commercial
  • Industrial
ProductCTE Z-axisTg
by TMA
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