The commercial wireless markets are highly competitive and have an ever increasing demand for more speed and bandwidth. Today’s designers are challenged more than ever with the task of achieving an optimal balance between cost and performance when selecting base materials.
Key factors include precise control of the tolerance adherence on the dielectric constant and dissipation factor, dielectric thickness and batch to batch product consistency. It has been well documented that to achieve controlled impedance and consistent electrical performance along the lines of amplitude and phase response RF high frequency designs require extremely precise controls on line widths (inductance), dielectric constant (resistance) and dielectric thickness (capacitance). If any one of these three factors is changed variations will be seen in impedance. As data transfer rates increase on the high speed digital frontier designers are looking to controlled dielectric materials as a means of achieving optimal signal performance. This would include the designers also paying closer attention to the selection of copper foils such as VLP-2 (very low profile 2 micron), as well as woven glass styles such as square weave or spread glass styles that would also help improve performance.
- Base Stations
|TerraGreen® (RF/MW Applications)||2.9||200||390||3.44||0.0039|
|I-Tera® MT40 (RF/MW Applications)||2.8||200||360||3.45||0.0031|
|IS680 AG||2.9||200||360||3.00 / 3.38 / 3.45||0.0020 - 0.0026|
Webinars, Videos & Articles
This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over
This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.
This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.
This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.
This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.
This paper presents the design, implementation and measurement of a high efficient GaN-HEMT power amplifier working at 2.4 GHz.
This article discusses how technology is changing the automotive industry.
This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.
This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.