DE156

Halogen-free Laminates and Prepregs

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
155°C
Td
390°C
Dk
4.00
Df
0.02
IPC-4101 - /128
UL - File Number E41625
DE156 is a base material of type FR-4. The resin matrix is based on a modified epoxy resin; conventional E-glass-fabric is used for reinforcement.

The requirements of flammability class V-0 as per UL 94 are met without addition of antimony compounds. Since this grade does not contain halogens, it displays greater thermal stability than a standard FR-4, as time to delamination (T260) measurements prove.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Halogen free
  • Processing Advantages
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC155°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss390°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    60
    >10
    Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    45
    220
    2.8
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg133ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    4.05
    4.01
    4.00
    3.97
    2.5.5.3
    2.5.5.9
    2.5.5.5
    2.5.5.5
    2.5.5.5
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    0.0130
    0.0161
    0.0167
    0.0172
    0.0172
    2.5.5.3
    2.5.5.9
    2.5.5.5
    2.5.5.5
    2.5.5.5
    Volume Resistivity
    A. C-96/35/90
    B. After moisture resistance
    C. At elevated temperature
    5.0 x 106
    3.0 x 107
    2.8 x 106
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. C-96/35/90
    B. After moisture resistance
    C. At elevated temperature
    2.0 x 103
    4.0 x 106
    1.0 x 107
    2.5.17.1
    Dielectric Breakdown60kV2.5.6B
    Arc Resistance115Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)36 (1500)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. At 125ºC (257ºF)
        3. After process solutions

    7.0

    8.0
    6.0
    7.0
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    89,500
    62,700
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    55,242
    39,335
    ksiASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.175
    0.143
    ASTM D3039
    Moisture Absorption0.1%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    03/16/2017
    02/23/2017
    04/18/2017
    10/08/2015
    10/17/2012

    Webinars, Videos & Articles

    High Tg Bromine-free Laminates for PWB Applications (Technical Paper)

    This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

    Halogen Free Base Materials for PWB Applications (Technical Paper)

    This paper discusses the challenges and concerns of commercially-available non-halogen materials.

    Laminate & Prepreg Manufacturing (Presentation)

    This presentation describes the process of laminate and prepreg manufacturing.

    Meeting Flame Resistance Requirements for Green Electronics (Presentation)

    This presentation discusses challenges and opportunities for halogen-free laminates.

    Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

    This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

    If you have any questions about DE156, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in DE156.

    • This field is for validation purposes and should be left unchanged.