FR402

Tetrafunctional Epoxy Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
140°C
Td
320°C
Dk
4.25
Df
0.015
IPC-4101 - /21
UL - File Number E41625
FR402 consists of a modified tetrafunctional epoxy resin system engineered for multilayer applications that require performance characteristics exceeding those of difunctional epoxies.

The formulation of FR402 is designed to enhance throughput and accuracy of laser based Automated Optical Inspection (AOI) equipment. FR402 offers superior resistance to chemical and thermal degradation.

Product Attributes

Typical Market Applications

  • There are no typical market applications.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, North America
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC140°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss315°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
30
>5
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
50
250
4.2
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg15ppm/°C2.4.24C
Thermal Conductivity.36W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
4.60
4.27
4.25
2.5.5.3
2.5.5.9
2.5.5.5
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
0.016
0.015
2.5.5.3
2.5.5.9
Dk, Permittivity@ 1 GHz0.0152.5.5.5
Volume Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
4.0 x 108
7.0 x 107
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
3.0 x 106
6.0 x 106
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance120Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)29 (1100)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.05 (8.0)

1.45 (9.0)
1.25 (8.0)
1.45 (9.0)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
92,000
62,300
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
60,000
43,150
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3500
3000
ksiASTM D790-15e2
Moisture Absorption0.3%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
03/16/2017
01/28/2014
10/17/2012

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Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

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