FR406N

FR406 No-Flo and
FR406 Lo-Flo® Specialty Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
170°C
Td
300°C
Dk
4.3
Df
0.025
IPC-4101 - /21 /24 /26
UL - File Number E41625
Isola offers a FR406N family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.

FR406 No-Flo and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

Typical Market Applications

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • Machinable by steel rule die or punch
    • Consistent dielectric spacing
    • Complete encapsulation of non-planar surfaces
    • Cure and form bond at low temperatures
    • Allows for lamination at non-uniform pressures
  • No-flow Prepreg
    • Adhesion to wide range of materials
    • Flex films – (Mylar®, Kapton®, etc.)
    • Treated or untreated copper
    • Plated metals (tin, solder, nickel, etc.)
    • Conventional laminate surfaces

Product Availability

  • Standard Material Offering: Laminate
  • Copper Foil Type
  • Copper Weight
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass

Production & Manufacturing

  • Currently manufactured in Asia, North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Pressed Thickness
A. 106
B. 1080
0.043 ±0.0008 (1.7 ±0.3)
0.069 ±0.0008 (2.7 ±0.3)
mm (mil)
Resin Content
A. 106
B. 1080
65 ±1.5%
Resin Flow Testing
A. 106
B. 1080
R&R
2.3.17
Modified Circle Flow
A. 106
B. 1080
0.050-0.120
Glass Transition Temperature (Tg) by DSC170°C2.4.25C
Cure Temperature Recommended for Full Cure370°C
Min. for Functional Bonding325°C
Z-Axis CTEPost-Tg75ppm/°C2.4.24C
X/Y-Axis CTEPre-Tg17/20ppm/°C2.4.24C
Thermal Conductivity.30W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Electric Strength (Laminate & laminated prepreg)1750kV/mm (V/mil)2.5.6.2A
Peel StrengthStandard profile copper >>> After thermal stress
10.0
N/mm (lb/inch)2.4.8C
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
04/14/2015
10/17/2012

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