G200

Epoxy Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
325°C
Dk
3.70
Df
0.013
IPC-4101 - /30
UL - File Number E41625
Isola’s G200 product is a fully proven laminate and prepreg system designed to meet today’s high reliability printed circuit board requirements.

Blending Bismaleimide/Triazine (BT) and epoxy resin provides G200 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer count Printed Wiring Boards (PWB).

Product Attributes

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • VLP-2 (2 micron), 1 oz and below
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC180°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss325°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    60
    >10
    Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    55
    275
    3.30
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
    Thermal Conductivity0.35W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    3.80
    3.70
    3.70
    3.65
    3.65
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    0.0150
    0.0150
    0.0130
    0.0150
    0.0150
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Volume Resistivity
    A. After moisture resistance
    B. At elevated temperature
    8.9 x 108
    6.5 x 108
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. After moisture resistance
    B. At elevated temperature
    2.21 x 106
    4.4 x 108
    2.5.17.1
    Dielectric Breakdown>60kV2.5.6B
    Arc Resistance130Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)45 (1175)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. After process solutions

    1.14 (6.5)

    0.96 (5.5)
    0.90 (5.1)
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    86,900
    73,600
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    51,551
    42,436
    ksiASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.182
    0.160
    ASTM D3039
    Moisture Absorption0.2%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    04/18/2017
    01/10/2015
    12/31/2015
    05/12/2014

    Webinars, Videos & Articles

    There are no related webinars, videos or articles available.

    If you have any questions about G200, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in G200.

    • This field is for validation purposes and should be left unchanged.