I-Tera® MT40 (RF/MW)

Very Low-Loss Laminate Material

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Thermal PerformanceElectrical PerformanceIndustry Approvals
IPC-4103 - /17
UL - File Number E41625
I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a very low dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • Dimensional stability
    • Multiple reflow capable
    • Multiple lamination cycles

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
    • 10, 20, 30, 60 mil (0.25, 0.51, 0.76, 1.5 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • VLP-2 (2 micron), 1 oz and below
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

  • Currently manufactured in North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Glass Transition Temperature (Tg) by TMA205°C2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
X/Y-Axis CTEPre-Tg12ppm/°C2.4.24C
Thermal Conductivity0.61W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 10 GHz
B. @ 10 GHz
C. @ 10 GHz
Bereskin Stripline
Df, Loss Tangent
A. @ 10 GHz
B. @ 10 GHz
C. @ 10 GHz
Bereskin Stripline
Volume ResistivityC-96/35/901.33 x 107MΩ-cm2.5.17.1
Surface ResistivityC-96/35/901.33 x 1052.5.17.1
Dielectric Breakdown45.4kV2.5.6B
Arc Resistance139Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength1 oz. EDC foil
1.0 (5.7)
N/mm (lb/inch)2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
Tensile Strength
A. Length direction
B. Cross direction
ksiASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
ASTM D3039
Moisture Absorption0.1%
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Webinars, Videos & Articles

PCB Material Selection for RF, Microwave and Millimeter-wave Design (Presentation)

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost (Presentation)

This presentation discusses the following:
- Printed Circuit Board (PCB)
- Requirements for Operation in mmWave Frequency Band
- Requirements for Automotive Safety Systems
- Available Materials
- Case Study: Automotive RADAR

New Thermoset PCB Material Emerging for mmWave Applications (Article)

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

PIM in PCBs: Mechanisms & Mitigation (Presentation)

This presentation describes the sources & physical mechanisms of PIM in communication systems.

Passive Intermodulation (PIM) in PCBs (Presentation)

This presentation the sources of Passive Intermodulation in PCBs and how to measure it.

If you have any questions about I-Tera MT40, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in I-Tera MT40.

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