IS400

High Performance Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
150°C		 Td
330°C		 Dk
3.90		 Df
0.022
IPC-4101 - /97 /98 /99 /101
UL - File Number E41625
IS400 is a proprietary, temperature resistant resin system with a Tg of 150°C.

It is intended for multilayer Printed Wiring Board (PWB) applications where demanding thermal performance and high reliability are required. IS400 laminate and prepreg products are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 330°C decomposition temperature and a low Z-axis expansion.

Product Attributes

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC150°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss330°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
>60
>10
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
50
260
3.3
ppm/°C
ppm/°C
%
2.4.24C
2.4.24C
X/Y-Axis CTEPre-Tg13ppm/°C2.4.24C
Thermal Conductivity0.36W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
4.00
3.90
—
2.5.5.3
2.5.5.9
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
0.020
0.022
—
2.5.5.3
2.5.5.9
Volume Resistivity
A. C-96/35/90
B. At elevated temperature
4.0 x 108
7.0 x 107
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. At elevated temperature
3.0 x 106
5.4 x 106
MΩ2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance120Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)48 (1100)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.05 (6.0)

1.45 (9.0)
1.25 (8.0)
1.45 (9.0)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
82,000
66,600
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
51,213
41,675
ksiASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.183
0.151
—ASTM D3039
Moisture Absorption0.18%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Core Data

ConstructionResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 Ghz2 GHz5 Ghz10 Ghz
1x10674.0%0.0020.051
3.91
0.0177
3.81
0.0200
3.80
0.0230
3.78
0.0240
3.72
0.0291
3.72
0.0292
1x108065.0%0.0030.076
4.03
0.0163
3.95
0.0185
3.91
0.0210
3.88
0.0222
3.82
0.0262
3.82
0.0263
1x211646.0%0.0040.102
4.45
0.0142
4.37
0.0159
4.39
0.0170
4.35
0.0182
4.32
0.0210
4.30
0.0211
1x211654.0%0.0050.127
4.21
0.0141
4.17
0.0158
4.15
0.0180
4.12
0.0187
4.06
0.0189
4.05
0.0191
1x165251.0%0.0060.152
4.28
0.0136
4.24
0.0152
4.22
0.0172
4.20
0.0179
4.14
0.0180
4.13
0.0182
1x762841.0%0.0070.178
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
1x762845.0%0.0080.203
4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
2x211654.0%0.0100.254
4.21
0.0141
4.17
0.0158
4.15
0.0180
4.12
0.0187
4.06
0.0189
4.05
0.0191
2x165251.0%0.0120.305
4.28
0.0136
4.24
0.0152
4.22
0.0172
4.20
0.0179
4.14
0.0180
4.13
0.0182
2x762842.0%0.0140.356
4.55
0.0137
4.48
0.0152
4.49
0.0162
4.45
0.0177
4.42
0.0190
4.39
0.0191
2x762844.0%0.0150.381
4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
2x762845.0%0.0160.406
4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
2x7628/211641.0%0.0180.457
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
3x762841.0%0.0210.533
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
3x762845.0%0.0240.610
4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
4x762841.0%0.0280.711
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
4x762844.0%0.0300.762
4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
4x762845.0%0.0310.787
4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
5x762841.0%0.0350.889
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
5x762844.0%0.0380.965
4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
5x762845.0%0.0390.991
4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
6x762841.0%0.0431.092
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
6x762845.0%0.0471.194
4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
8x762841.0%0.0581.473
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
10x762844.0%0.0761.930
4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
11x762844.0%0.0792.007
4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
13x762841.0%0.0882.235
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
14x762841.0%0.0942.388
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
17x762841.0%0.1182.997
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
18x762841.0%0.1253.175
4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189

Prepreg Data

Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 Ghz2 GHz5 Ghz10 Ghz
10674.0%0.00230.058
3.91
0.0177
3.81
0.0200
3.80
0.0230
3.78
0.0240
3.72
0.0291
3.72
0.0292
108065.0%0.00310.079
4.03
0.0163
3.95
0.0185
3.91
0.0210
3.88
0.0222
3.82
0.0262
3.82
0.0263
108069.0%0.00350.089
3.97
0.0170
3.89
0.0192
3.86
0.0220
3.84
0.0232
3.77
0.0275
3.77
0.0277
211357.0%0.00400.102
4.20
0.0161
4.11
0.0180
4.10
0.0200
4.08
0.0210
4.03
0.0240
4.02
0.0241
211653.0%0.00470.119
4.30
0.0145
4.21
0.0163
4.20
0.0186
4.18
0.0194
4.13
0.0225
4.12
0.0226
211657.0%0.00530.135
4.20
0.0161
4.11
0.0180
4.10
0.0200
4.08
0.0210
4.03
0.0240
4.02
0.0241
762846.0%0.00790.201
4.45
0.0142
4.37
0.0159
4.39
0.0170
4.35
0.0182
4.32
0.0210
4.30
0.0211
762851.0%0.00870.221
4.35
0.0143
4.26
0.0160
4.25
0.0181
4.23
0.0189
4.18
0.0220
4.17
0.0221
NOTE
IS400 Material Declaration
03/16/2017
IS400 Laminate MSDS Data Sheet
03/16/2017
IS400 Prepreg MSDS Data Sheet
03/16/2017
IS400 Prepreg RoHS Declaration
12/31/2015
IS400 Laminate RoHS Declaration
12/31/2015
IS400 Processing Guide
05/22/2013

Webinars, Videos & Articles

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

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