IS400HR

High Performance Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
150°C
Td
330°C
Dk
4.20
Df
0.016
IPC-4101 - /97 /98 /99 /101
UL - File Number E41625
IS400HR is a proprietary, temperature resistant resin system with a Tg of 150°C.  

It is intended for multilayer Printed Wiring Board (PWB) applications where demanding thermal performance and high reliability are requried. IS400HR laminate prepreg products are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 300°C decomposition temperature and a low Z-axis expansion.

Product Attributes

  • There are no product attributes.

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC150°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss330°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    >60
    >10
    Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    40
    230
    3.0
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg13ppm/°C2.4.24C
    Thermal Conductivity0.36W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 500 MHz
    C. @ 1 GHz
    4.3
    4.2
    4.2
    2.5.5.9
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 500 MHz
    C. @ 1 GHz
    0.014
    0.015
    0.016
    2.5.5.9
    Volume Resistivity
    A. C-96/35/90
    B. At elevated temperature
    4.0 x 108
    7.0 x 107
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. C-96/35/90
    B. At elevated temperature
    3.0 x 106
    5.4 x 106
    2.5.17.1
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance120Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)48 (1100)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. At 125ºC (257ºF)
        3. After process solutions

    0.969 (5.5)

    1.06 (5.9)
    1.06 (5.9)
    0.969 (5.5)
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    83,000
    67,600
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    50,021
    34,983
    ksiASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.145
    0.124
    ASTM D3039
    Moisture Absorption0.18%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    03/15/2017
    03/15/2017
    04/18/2017
    05/03/2016
    06/02/2016

    Webinars, Videos & Articles

    Laminate & Prepreg Manufacturing (Presentation)

    This presentation describes the process of laminate and prepreg manufacturing.

    Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction (Presentation)

    This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

    If you have any questions about IS400HR, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in IS400HR.

    • This field is for validation purposes and should be left unchanged.