IS410

Lead-free Epoxy Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
350°C
Dk
3.97
Df
0.02
IPC-4101 - /21 /24 /26 /121 /124 /129
UL - File Number E41625
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder.

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • 6x 288°C solder float capable
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss350°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
50
10
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
250
3.5
ppm/°C
ppm/°C
%
2.4.24C
2.4.24C
X/Y-Axis CTEPre-Tg11ppm/°C2.4.24C
Thermal Conductivity0.5W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.96
3.90
3.97
3.87
3.87
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0149
0.0189
0.0200
0.0230
0.0230
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
8.0 x 108
3.6 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
8.0 x 106
4.5 x 10(8)
2.5.17.1
Dielectric Breakdown>50kV
Arc Resistance129Seconds
Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.225 (7.0)
1.14 (6.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
82,600
66,400
2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
60,890
45,750
ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.175
0.143
ASTM D3039
Moisture Absorption0.20%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Core Data

ConstructionResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 Ghz2 GHz5 Ghz10 GHz
1x10670.0%0.00200.051
3.59
0.0178
3.54
0.0203
3.51
0.0234
3.48
0.0240
3.40
0.0290
3.40
0.0290
1x108057.0%0.00250.064
3.83
0.0158
3.79
0.0178
3.77
0.0205
3.74
0.0210
3.67
0.0250
3.67
0.0250
1x108063.0%0.00300.076
3.71
0.0167
3.67
0.0189
3.65
0.0217
3.62
0.0230
3.54
0.0270
3.56
0.0270
1x211346.0%0.00300.076
4.08
0.0141
4.04
0.0156
4.02
0.0177
3.99
0.0180
3.93
0.0210
3.93
0.0210
1x211351.0%0.00350.089
3.96
0.0171
3.92
0.0193
3.90
0.0222
3.87
0.0230
3.81
0.0270
3.81
0.0270
2x10665.0%0.00350.089
3.68
0.0149
3.63
0.0166
3.61
0.0189
3.58
0.0200
3.50
0.0230
3.50
0.0230
1x211645.0%0.00400.102
4.10
0.0139
4.06
0.0154
4.05
0.0175
4.02
0.0180
3.96
0.0210
3.96
0.0210
1x211649.0%0.00430.109
4.01
0.0134
3.97
0.0149
3.95
0.0167
3.92
0.0170
3.86
0.0200
3.86
0.0200
106/108060.0%0.00430.109
3.77
0.0163
3.73
0.0183
3.71
0.0210
3.68
0.0220
3.60
0.0260
3.60
0.0260
1x165242.0%0.00500.127
4.17
0.0156
4.14
0.0176
4.12
0.0203
4.10
0.0210
4.04
0.0250
4.04
0.0250
106/211356.0%0.00530.135
3.85
0.0152
3.81
0.0170
3.79
0.0194
3.76
0.0200
3.69
0.0240
3.69
0.0240
1080/211353.0%0.00600.152
3.92
0.0133
3.88
0.0147
3.86
0.0165
3.83
0.0170
3.76
0.0200
3.76
0.0200
2113/211651.0%0.00700.178
3.96
0.0150
3.92
0.0168
3.90
0.0191
3.87
0.0200
3.81
0.0230
3.81
0.0230
1x762841.0%0.00700.178
4.20
0.0149
4.16
0.0166
4.15
0.0189
4.12
0.0200
4.07
0.0230
4.07
0.0230
2x211645.0%0.00800.203
4.10
0.0139
4.06
0.0154
4.05
0.0175
4.02
0.0180
3.96
0.0210
3.96
0.0210
2x1080/211647.0%0.01000.254
4.05
0.0142
4.01
0.0158
4.00
0.0179
3.97
0.0190
3.91
0.0220
3.91
0.0220
2x165242.0%0.01000.254
4.17
0.0134
4.14
0.0149
4.12
0.0167
4.10
0.0170
4.04
0.0200
4.04
0.0200
2x1080/762847.0%0.01200.305
4.05
0.0142
4.01
0.0158
4.00
0.0179
3.97
0.0190
3.91
0.0220
3.91
0.0220
2x762842.0%0.01400.356
4.17
0.0134
4.14
0.0149
4.12
0.0167
4.10
0.0170
4.04
0.0200
4.04
0.0200
2x7628/211642.0%0.01800.457
4.17
0.0134
4.14
0.0149
4.12
0.0167
4.10
0.0170
4.04
0.0200
4.04
0.0200
3x762840.0%0.02100.533
4.22
0.0131
4.19
0.0145
4.17
0.0163
4.18
0.0170
4.11
0.0200
4.11
0.0200

Prepreg Data

Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 Ghz2 GHz5 Ghz10 GHz
10675.0%0.00230.058
3.50
0.0186
3.45
0.0212
3.46
0.0246
3.39
0.0260
3.30
0.0310
3.30
0.0310
108065.0%0.00300.076
3.68
0.0171
3.63
0.0193
3.61
0.0222
3.58
0.0230
3.50
0.0275
3.50
0.0275
211357.0%0.00390.099
3.83
0.0158
3.79
0.0178
3.77
0.0203
3.74
0.0210
3.67
0.0250
3.67
0.0250
211656.0%0.00500.127
3.85
0.0156
3.81
0.0176
3.79
0.0205
3.76
0.0210
3.69
0.0250
3.69
0.0250
762844.0%0.00740.188
4.12
0.0137
4.09
0.0153
4.07
0.0172
4.04
0.0180
3.98
0.0210
3.98
0.0210
NOTE
Please Contact us for more details in below details.
Isola Group 3100 West Ray Road
Suite 301
Chandler, AZ 85226

Phone: 480-893-6527
Phone: 800-537-7656
Fax: 480-893-1409
03/16/2017
11/19/2015
10/17/2012

Webinars, Videos & Articles

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

Material & Process Influences on Conductive Anodic Filamentation (CAF) (Presentation)

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

If you have any questions about IS410, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in IS410.

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