IS415

High Thermal Performance Epoxy Material

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
200°C
Td
370°C
Dk
3.72
Df
0.0120
IPC-4101 - /98 /99 /101 /126
UL - File Number E41625
IS415 sets the industry standard for high thermal performance epoxy materials and is ideally suited for designs requiring high signal integrity.

This product is engineered to meet the demands of Lead (Pb) free multilayer printed circuit assembly, deliver CAF resistance with strong IST results and maintain FR-4 processing. IS415 offers good electrical performance, superior chemical and thermal performance and product consistency.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence
    • No post bake after pressing

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • VLP-2 (2 micron), 1 oz and below
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC200°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss370°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    60
    >20
    Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    45
    240
    2.8
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg13ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    3.75
    3.71
    3.72
    3.71
    3.71
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    0.0107
    0.0131
    0.0120
    0.0127
    0.0125
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Volume Resistivity
    A. After moisture resistance
    B. At elevated temperature
    3.81 x 108
    3.90 x 108
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. After moisture resistance
    B. At elevated temperature
    2.81 x 106
    2.64 x 108
    2.5.17.1
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance120Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)40 (1100)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. At 125ºC (257ºF)
        3. After process solutions

    1.14 (6.5)

    1.225 (7.0)
    1.14 (6.5)
    0.90 (5.1)
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    74,200
    51,600
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    43,750
    31,520
    ksiASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.158
    0.138
    ASTM D3039
    Moisture Absorption0.15%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    03/16/2017
    02/23/2017
    04/18/2017
    05/18/2015
    06/06/2013

    Webinars, Videos & Articles

    Laminate & Prepreg Manufacturing (Presentation)

    This presentation describes the process of laminate and prepreg manufacturing.

    If you have any questions about IS415, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in IS415.

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