IS420

High Performance Laminate and Prepreg

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Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
170°C
Td
350°C
Dk
4.04
Df
0.021
IPC-4101 - /98 /99 /101
UL - File Number E41625
IS420 is a high performance 170°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability.
In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.

Typical Market Applications

  • There are no typical market applications.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC170°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss350°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>15
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal Conductivity0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.24
4.17
4.04
3.92
3.92
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0161
0.0210
0.0250
0.0250
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance115Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
TBDksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
TBDksiASTM D3039
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
03/16/2017
03/16/2015
10/17/2012

Webinars, Videos & Articles

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

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