Automotive & Transportation

Isola Transportation Materials

Isola drives innovation into automobile, railway and aircraft electronics with thermally-reliable laminate materials.

Reliability is a key driver for PCB designers in the automotive and transportation industries. Isola has developed materials engineers to provide superior thermal endurance, both with respect to operating temperature and thermal cycling performance, achieved with patented filler technology, meeting or exceeding the most demanding customer requirements.

The need for advanced automotive safety and driver assistance systems such as collision avoidance and emergency braking, blind spot detection and lane departure warning are increasing with both regulatory mandates and consumer demand for improved safety. Isola has been successful in developing extremely cost-effective alternatives to PTFE and other commercial microwave laminate materials in order to engage with the mass-market deployment of these systems.

Additionally, Isola offers certified laminate systems according to standards set forth by the International Union of Railways and its member organizations.

Isola’s 370HR and IS400 are classified according to the French standard NF F 16-101: “Rolling Stock – Fire Behaviour – Materials Selection,” to the European (EN 45545-2:2013), to the Italian

DE104, 185HR and IS410 are certified according to the European standard (EN 45545-2:2013). 185HR is also certified according the French standard (NF F 16-101).

ProductCTE Z-axisTg
by TMA
TdDkDf
TerraGreen® (RF/MW)2.92003903.450.0032
I-Tera® MT40 (RF/MW)N/A2003603.450.0031
370HR2.81803404.040.0210
I-Tera® MT402.82003603.450.0031
P95/P251.52604163.760.017
IS4103.51803503.970.02
IS4003.31503303.900.022
ED130UVN/A135N/A4.350.017
DE1044.21353154.370.022
Astra® MT772.92003603.000.0017
185HR2.71803404.010.0200

Webinars, Videos & Articles

Laminate Materials with Low Dielectric Properties (Technical Paper)

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Thermal Management of PCBs in Embedded Systems (Presentation)

This presentation discusses thermal management considerations for embedded systems.

PCB Material Selection for High-speed Digital Designs (Presentation)

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

PCB Material Selection for RF, Microwave and Millimeter-wave Design (Presentation)

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost (Presentation)

This presentation discusses the following:
- Printed Circuit Board (PCB)
- Requirements for Operation in mmWave Frequency Band
- Requirements for Automotive Safety Systems
- Available Materials
- Case Study: Automotive RADAR

New Thermoset PCB Material Emerging for mmWave Applications (Article)

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

Thermosets' Cost and Reliability Advantages for Automotive Radar PCBs (White Paper)

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Conductive Anodic Filament Growth Failure (Technical Paper)

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

COATED COPPER FOILS FOR HIGH DENSITY INTERCONNECTS (Technical Paper)

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics? (Article)

This article discusses how technology is changing the automotive industry.

CAF Resistance of NON-DICY FR-4 (Article)

This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.

Material & Process Influences on Conductive Anodic Filamentation (CAF) (Presentation)

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction (Presentation)

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.