Isola materials helps put the consumer in control of their electronic devices.
High-performance laminate materials are used in a variety of advanced electronics, including high-end consumer electronics. The increasingly complex performance and environmental requirements of today’s smart devices are driving greater demand for higher performance PCBs, which require laminate materials with resins specifically formulated to satisfy demanding performance criteria.
Webinars, Videos & Articles
This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.
This paper discusses the challenges and concerns of commercially-available non-halogen materials.
This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.
This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.
This paper discusses the continuing evolution of FR-4 base materials.
This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.
This paper defines a “best practice” methodology to be used in determining selection criteria for lead-free assembly materials.
This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.
This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.
This presentation discusses thermal management considerations for embedded systems.
This presentation outlines SITV stack-ups general, loss characterization and balancing resin content.
This presentation outlines practical fiber weave effect model for skew and jitter.
This presentation describes the sources & physical mechanisms of PIM in communication systems.
This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.
This presentation the sources of Passive Intermodulation in PCBs and how to measure it.
This presentation discusses challenges and opportunities for halogen-free laminates.