Aerospace & Defense

Isola Military & Areospace

Isola offers high reliability and superior performance laminate materials for extreme conditions.

Isola’s high-speed digital and RF/microwave materials are ideal for military and aerospace applications as they offer high glass-transition temperatures, very high decomposition temperatures and low expansion rates—all attributes required for demanding military and aerospace applications.

Our materials are in stock and ready to ship both domestically and abroad.

 

 

Typical Applications

Many of our materials meet the stringent requirements of the Airbus Directive ABD0031, “Fireworthiness Requirements Pressurized Section of Fuselage”, having passed flammability, heat, smoke and degassing of toxic vapors testing.

ProductFlammability Test
(Vertical Bunsen Burner 12s)
Smoke Test (Specific Optical Density of Smoke)Toxicity Test
(Critical Smoke Concentration)
Tg °C
IS400PassPassPass150
IS420PassPassPass170
370HRPassPassPass180
185HRPassPassPass180
P96PassPassPass260
DE156PassPassPass155
ProductCTE Z-axisTg
by TMA
TdDkDf
TerraGreen® (RF/MW)2.92003903.440.0039
I-Tera® MT40 (RF/MW)N/A2003603.450.0031
IS680 AG2.92003603.00 / 3.38 / 3.450.0020 - 0.0026
IS6802.92003602.80-3.450.0025-0.0035
Tachyon® 100G2.51853803.020.0021
370HR2.81803404.040.0210
I-Speed®2.71803603.640.0060
I-Tera® MT402.82003603.450.0031
P25N--2503833.670.0187
P95/P251.52604163.760.017
P96/P261.52603963.760.017
IS4103.51803503.970.02
G2003.301803253.700.013
FR408HR2.81903603.680.0092
FR4083.51803603.670.0120
FR406NN/A1703004.30.025
Astra® MT772.92003603.000.0017
185HR2.71803404.010.0200

Webinars, Videos & Articles

PCB Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements (Technical Paper)

This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.

Laminate Materials with Low Dielectric Properties (Technical Paper)

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Signal Integrity Considerations in High-Reliability Designs (Article)

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

Conductive Anodic Filament Growth Failure (Technical Paper)

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

COATED COPPER FOILS FOR HIGH DENSITY INTERCONNECTS (Technical Paper)

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions (Technical Paper)

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability (Technical Paper)

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

PCB Material Selection for High-speed Digital Designs (Presentation)

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

PCB Material Selection for RF, Microwave and Millimeter-wave Design (Presentation)

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Material Emerging for mmWave Applications (Article)

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

Thermal Management of PCBs in Embedded Systems (Presentation)

This presentation discusses thermal management considerations for embedded systems.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? (Presentation)

This presentation describes smeared resin, hole debris and post separation ICDs.

Prepreg Selection: Individual Dielectric Space (Application Note)

This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.