TerraGreen® (RF/MW)

Halogen-free, Very Low Loss Material

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
200°C
Td
390°C
Dk
3.44
Df
0.0039
IPC-4103 - /17
UL - File Number E41625
TerraGreen® laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

TerraGreen® is engineered for such high performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to to W-band.

TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.

TerraGreen® meets UL 94 V-0 and is halogen free.

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • Halogen free
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 10, 20, 30, 60 mil (0.25, 0.51, 0.76, 1.5 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • VLP-2 (2 micron), 1 oz and below
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability

Production & Manufacturing

  • Currently manufactured in North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss390°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60Minutes2.4.24.1
Z-Axis CTE50 to 260°C, (Total Expansion)2.9%2.4.24C
X/Y-Axis CTEPre-Tg16ppm/°C2.4.24C
Thermal Conductivity0.32W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
3.442.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.0039Bereskin Stripline
Volume ResistivityC-96/35/901.33 x 107MΩ-cm2.5.17.1
Surface ResistivityC-96/35/901.33 x 1052.5.17.1
Dielectric Breakdown45.4kV2.5.6B
Arc Resistance139Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)In TestingClass (Volts)UL 746A
ASTM D3638
Peel Strength
A. 0.5 oz. EDC foil
B. 1 oz. EDC foil

0.88 (5.0)
N/mm (lb/inch)2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
75,500
60,000
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
40,000
39,000
ksiASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.238
0.231
ASTM D3039
Moisture Absorption0.5%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
09/23/2013

Webinars, Videos & Articles

Halogen Free Base Materials for PWB Applications (Technical Paper)

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

If you have any questions about TerraGreen, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in TerraGreen.

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