TerraGreen®

Halogen-free, Very Low Loss Material

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
200°C
Td
390°C
Dk
3.44
Df
0.0039
IPC-4103 - /17
UL - File Number E41625
TerraGreen® laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

TerraGreen® is engineered for such highperformance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz.

TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.

TerraGreen® meets UL 94 V-0 and is halogen free.

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • VLP-2 (2 micron), 1 oz and below
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

  • Currently manufactured in North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss390°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60Minutes2.4.24.1
Z-Axis CTE50 to 260°C, (Total Expansion)2.9%2.4.24C
X/Y-Axis CTEPre-Tg16ppm/°C2.4.24C
Thermal Conductivity0.32W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
3.442.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.0039Bereskin Stripline
Volume ResistivityC-96/35/901.33 x 107MΩ-cm2.5.17.1
Surface ResistivityC-96/35/901.33 x 1052.5.17.1
Dielectric Breakdown45.4kV2.5.6B
Arc Resistance139Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)In TestingClass (Volts)UL 746A
ASTM D3638
Peel Strength
A. 0.5 oz. EDC foil
B. 1 oz. EDC foil

0.88 (5.0)
N/mm (lb/inch)2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
75,500
60,000
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
40,000
39,000
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3125
2745
ksiASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.238
0.231
ASTM D3039
Moisture Absorption0.5%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Core Data

ConstructionGlass TypeResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
2 Ghz5 Ghz10 GHz15 Ghz20 Ghz
1x1037Spread73.0%0.0020.051
3.10
0.0025
3.10
0.0026
3.10
0.0026
3.10
0.0026
3.10
0.0026
1x1067Spread70.0%0.00250.064
3.25
0.0027
3.25
0.0028
3.25
0.0028
3.25
0.0028
3.24
0.0028
1x1078Spread63.0%0.0030.076
3.40
0.0031
3.40
0.0032
3.40
0.0032
3.40
0.0032
3.40
0.0032
1x1078Spread67.0%0.00350.089
3.30
0.0029
3.30
0.003
3.30
0.003
3.30
0.003
3.30
0.003
1x331354.0%0.0040.102
3.60
0.0037
3.60
0.0037
3.60
0.0037
3.60
0.0037
3.60
0.0037
2x1037Spread73.0%0.00430.109
3.10
0.0025
3.10
0.0026
3.10
0.0026
3.10
0.0026
3.10
0.0026
2x1067Spread67.0%0.00450.114
3.31
0.0029
3.31
0.003
3.31
0.003
3.31
0.003
3.31
0.003
1x331358.0%0.00450.114
3.50
0.0034
3.50
0.0035
3.50
0.0035
3.50
0.0035
3.50
0.0035
2x1067Spread70.0%0.0050.127
3.54
0.0027
3.54
0.0028
3.54
0.0028
3.54
0.0028
3.54
0.0028
1x331362.0%0.0050.127
3.42
0.0032
3.42
0.0033
3.42
0.0033
3.42
0.0033
3.42
0.0033
1x211654.0%0.0050.127
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
2x1078Spread60.0%0.00550.14
3.48
0.0035
3.48
0.0035
3.48
0.0035
3.48
0.0035
3.48
0.0035
1x211657.0%0.00550.14
3.54
0.0033
3.54
0.0034
3.54
0.0034
3.54
0.0034
3.54
0.0034
1x211660.0%0.0060.152
3.47
0.0033
3.47
0.0034
3.47
0.0034
3.47
0.0034
3.47
0.0034
2x1078Spread63.0%0.00620.157
3.40
0.0031
3.40
0.0032
3.40
0.0032
3.40
0.0032
3.40
0.0032
2x1078Spread67.0%0.0070.178
3.30
0.0029
3.30
0.003
3.30
0.003
3.30
0.003
3.30
0.003
2x1078Spread69.3%0.00760.193
3.27
0.0027
3.27
0.0028
3.27
0.0028
3.27
0.0028
3.27
0.0028
2x331354.0%0.0080.203
3.60
0.0037
3.60
0.0037
3.60
0.0037
3.60
0.0037
3.60
0.0037
2x331358.0%0.0090.229
3.50
0.0034
3.50
0.0035
3.50
0.0035
3.50
0.0035
3.50
0.0035
2x331362.0%0.010.254
3.42
0.0032
3.42
0.0033
3.42
0.0033
3.42
0.0033
3.42
0.0033
2x211654.0%0.010.254
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
3x331354.0%0.0120.305
3.60
0.0037
3.60
0.0037
3.60
0.0037
3.60
0.0037
3.60
0.0037
2x3313/1078Spread61.5%0.0130.33
3.42
0.0031
3.42
0.0032
3.42
0.0032
3.42
0.0032
3.42
0.0032
2x3313/1078Spread62.5%0.01320.335
3.41
0.0031
3.41
0.0032
3.41
0.0032
3.41
0.0032
3.41
0.0032
2x3313/1078Spread64.5%0.0140.356
3.37
0.0031
3.37
0.0031
3.37
0.0031
3.36
0.0031
3.36
0.0031
3x331364.5%0.0150.381
3.42
0.0032
3.42
0.0033
3.42
0.0033
3.42
0.0033
3.42
0.0033
3x211654.0%0.0150.381
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
2x1078/2x331362.4%0.0160.406
3.42
0.0031
3.42
0.0032
3.42
0.0032
3.42
0.0032
3.42
0.0032
2x1078/2x331363.6%0.01680.427
3.39
0.0032
3.39
0.0032
3.39
0.0032
3.39
0.0032
3.39
0.0032
4x331358.0%0.0180.457
3.50
0.0034
3.50
0.0035
3.50
0.0035
3.50
0.0035
3.50
0.0035
4x331362.0%0.020.508
3.42
0.0032
3.42
0.0033
3.42
0.0033
3.42
0.0033
3.42
0.0033
4x211654.0%0.020.508
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037
3.61
0.0037

Prepreg Data

Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
2 Ghz5 Ghz10 GHz15 Ghz20 Ghz
1037 Spread73.00%0.00220.056
3.18
0.0025
3.18
0.0026
3.18
0.0026
3.18
0.0026
3.18
0.0026
10673.00%0.00230.058
3.18
0.0025
3.18
0.0026
3.18
0.0026
3.18
0.0026
3.18
0.0026
1067 Spread70.00%0.00250.064
3.25
0.0027
3.25
0.0028
3.25
0.0028
3.25
0.0028
3.24
0.0028
1078 Spread60.00%0.00280.071
3.47
0.0033
3.47
0.0034
3.47
0.0034
3.47
0.0034
3.47
0.0034
1067 Spread73.00%0.00290.074
3.18
0.0025
3.18
0.0026
3.18
0.0026
3.18
0.0026
3.18
0.0026
1078 Spread63.00%0.00310.079
3.40
0.0031
3.40
0.0032
3.40
0.0032
3.40
0.0032
3.40
0.0032
1078 Spread67.00%0.00350.089
3.31
0.0029
3.31
0.003
3.31
0.003
3.31
0.003
3.31
0.003
108068.00%0.00360.091
3.29
0.0028
3.29
0.0029
3.29
0.0029
3.29
0.0029
3.29
0.0029
108071.00%0.0040.102
3.22
0.0027
3.22
0.0027
3.22
0.0027
3.22
0.0027
3.22
0.0027
1078 Spread71.00%0.00410.104
3.22
0.0027
3.22
0.0027
3.22
0.0027
3.22
0.0027
3.22
0.0027
331358.00%0.00450.114
3.50
0.0034
3.50
0.0035
3.50
0.0035
3.50
0.0035
3.50
0.0035
331362.00%0.00510.13
3.42
0.0032
3.42
0.0033
3.42
0.0033
3.42
0.0033
3.42
0.0033
331365.00%0.00560.142
3.35
0.003
3.35
0.0031
3.35
0.0031
3.35
0.0031
3.35
0.0031
211657.00%0.00560.142
3.54
0.0035
3.54
0.0035
3.54
0.0035
3.54
0.0035
3.54
0.0035
211660.00%0.00610.155
3.47
0.0033
3.47
0.0034
3.47
0.0034
3.47
0.0034
3.47
0.0034
NOTE
Please Contact us for more details in below details.
Isola Group 3100 West Ray Road
Suite 301
Chandler, AZ 85226

Phone: 480-893-6527
Phone: 800-537-7656
Fax: 480-893-1409
09/23/2013

Webinars, Videos & Articles

High Tg Bromine-free Laminates for PWB Applications (Technical Paper)

This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

Halogen Free Base Materials for PWB Applications (Technical Paper)

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

Meeting Flame Resistance Requirements for Green Electronics (Presentation)

This presentation discusses challenges and opportunities for halogen-free laminates.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

If you have any questions about TerraGreen, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in TerraGreen.

  • This field is for validation purposes and should be left unchanged.