DE104i
4.0 Dk , 0.022 Df
140 Tg , 330 Td
/121 /21
Increasing thermal requirements, especially in automotive electronics, have driven the successful development of DE104i.
The excellent thermal resistance, due to the special resin system and the low coefficient of thermal expansion in the Z-axis, enable a lifespan up to 1000 cycles at temperature change (- 40 to +125°C) and the ability to withstand up to 10 cycles of lead-free soldering.
The glass transition temperature is 140°C (DSC). Time to delamination of the laminate at a temperature of 260°C is greater than 60 minutes and the decomposition temperature, Td is 330°C. The product is listed as FR-4 and can be processed using standard parameters. All thin laminates DE104i ML correspond to NEMA-grade FR-4 and meet the requirements of IPC-4104C/21.
Key Features
Industry Approvals
- IPC-4101C /21/121
- UL Recognized – FR-4, File Number E41625
- Qualified to UL’s MCIL Program
High Thermal Performance
- Tg of 140°C (DSC)
- Td of 330°C (TMA)
UV Blocking and AOI Fluorescence
- High throughput and accuracy during PCB fabrication and assembly
Standard Availability
- Thickness: 0.002″ [.05 mm] to 0.093″ [2.4 mm]
- Available in sheet or panel form
- Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz.
- Foil Options: Reverse treat
- Prepregs: Available in roll or panel form