FR406N
3.48 Dk , 0.021 Df
170 Tg , 300 Td
/24 /26 /28
Isola offers a family of No-Flo Prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
FR406 N0-Flo and FR406 Lo-Flo® bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
Key Features
Industry Approvals
- FR406N No-Flo and Lo-Flo®
- IPC-4101C /24 /26/28
- UL V-0
Minimal, Uniform Resin Flow
- Complete encapsulation and embedment of no-planar surfaces
- Consistent dielectric spacing
Wide Range of Thermal Performance
- High temperature FR-4 epoxy –170°C Tg
Adhesion to Wide Range of Materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper-plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Processing Ease
- Machinable to complex shapes by steel rule die and punching
- Allows for lamination at non-uniform pressures
- Cure and form bond at low temperatures
Availability
- Glass Styles: 106, 1080
- Available in 38″ rolls or paneled forms