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Products > FR406N

FR406N Tg 170, Td 300
Dk 3.48, Df 0.021
/21 /24 /26

Isola offers a FR406N family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.

FR406 No-Flo and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

Key Features

Industry Approvals

  •    FR406N No-Flo and Lo-Flo®
  •    IPC-4101C /21 /24 /26
  •    UL V-0

Minimal, Uniform Resin Flow

  • Complete encapsulation and embedment of no-planar surfaces
  • Consistent dielectric spacing

Wide Range of Thermal Performance

  • High temperature FR-4 epoxy –170°C  Tg

Adhesion to Wide Range of Materials

  • Flex films – (Mylar®, Kapton®, etc.)
  • Treated or untreated copper-plated metals (tin, solder, nickel, etc.)
  • Conventional laminate surfaces

Processing Ease

  • Machinable to complex shapes by steel rule die and punching
  • Allows for lamination at non-uniform pressures
  • Cure and form bond at low temperatures

Availability

  • Glass Styles: 106, 1080
  • Available in 38″ rolls or paneled forms

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