FR406N
Tg 170, Td 300
Dk 3.48, Df 0.021
/21 /24 /26
Isola offers a FR406N family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
FR406 No-Flo and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
Key Features
Industry Approvals
- FR406N No-Flo and Lo-Flo®
- IPC-4101C /21 /24 /26
- UL V-0
Minimal, Uniform Resin Flow
- Complete encapsulation and embedment of no-planar surfaces
- Consistent dielectric spacing
Wide Range of Thermal Performance
- High temperature FR-4 epoxy –170°C Tg
Adhesion to Wide Range of Materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper-plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Processing Ease
- Machinable to complex shapes by steel rule die and punching
- Allows for lamination at non-uniform pressures
- Cure and form bond at low temperatures
Availability
- Glass Styles: 106, 1080
- Available in 38″ rolls or paneled forms
