IS620/IS620i
3.58 Dk , 0.006 Df
225 Tg , 364 Td
/30
IS620i is the first material in the digital products class built upon existing technologies, yet offering significant advantages for today’s digital world. The resin matrix of IS620i is uniquely formulated for high-speed applications ranging from 2 to 15 GHz, providing a low, flat loss response over the entire range.
It is optimal for digital designs and is available in both laminate and prepreg in all typical thicknesses and standard panel sizes. IS620i offers the designer and fabricators the flexibility of digital design, the assurance of supply, and the ease of conventional FR-4 processing. IS620i is the first material in its class to offer the complete package of each of the critical items: low loss with a flat response over frequency, availability in both laminate and prepreg form in typical thicknesses and sizes, and the ability to use conventional fabrication techniques.
Key Features
Industry Approvals
- IPC 4101C /30
- UL Recognized –Non-ANSI File Number E41625
High Thermal Performance
- Tg of 225°C (DSC)
- Td of 364°C (TGA)
Improved Dielectric Properties
- Supports increased signal speeds
- Flat loss response over frequency
UV Blocking and AOI Fluorescence
- High throughput and accuracy during PCB fabrication and assembly
PCB Fabrication
- Utilizes conventional FR-4 processes
Standard Availability
- Thickness: 0.002″ [.05 mm] to 0.093″ [2.4 mm]
- Available in sheet or panel form
- Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz. greater on request.
- Foil Options: Double treat, reverse treat
- Prepregs: Available in roll or panel form
- Glass Style: 106, 1080, 2113, 3070, 2116, 3313, 1652