IS680-338
Tg 200, Td 360
Dk 3.38, Df 0.0035
IS680-338 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
IS680-338 is suitable for many of today’s commercial RF/microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C at up to 20 GHz. In addition, IS680 offers a lower dissipation factor (Df) of 0.0035 making it a cost-effective alternative to PTFE and other commercial microwave laminate materials.
Key Features
Electrical Properties
- Dk Range 3.38 ± 0.05
- Df Range 0.0030 to 0.0040
- Exceptional dielectric properties over a broad frequency and temperature range per IPC -TM-650-2.5.5.5
High Thermal Performance
- Tg of 200°C (DSC)
- Td of 360°C (TGA)
- Low CTE in the Z-axis 2.9% (-55 to 260°C)
Available in Laminate
- IS680 offers a complete laminate materials solution for single and double sided printed circuit designs
Standard Availability
- Thicknesses: 0.020”, 0.030”, 0.060”
- Copper Cladding: ½, 1 and 2 ounce (heavier copper available)
UL 94 Flame Classification
- V-0 File# E41625
