P26N
Tg 250, Td 383
Dk 3.76, Df 0.017
/40 /41 /42
Isola offers a P26N product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.
These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Key Features
High Tg – 250°C (TMA)
- Greater thermal performance over competitive products with very high epoxy content
Industry Approvals
- IPC-4101C /40 /41 /42
- UL Recognized – GPY, File Number E41625
Maintains Bond Strength at High Temperature
Tough Resin System
- Improved processing due to less brittleness
- Less delamination from machining
Brominated Chemistry, Thermally Stable Laminate System
- Full benefits of 100% polyimide performance
Non-MDA (Methylene Dianiline) Chemistry
- Meets all OSHA 1910.1050 requirements
Standard Availability
- Prepregs: Available in roll or panel form
- Glass Styles: 106 & 1080 fabrics
