Computing, Storage & Peripherals
Isola’s high-speed digital materials are the base for the Internet of Things.
Wikipedia defines “The Internet of Things” or IoT. as “the interconnection of uniquely identifiable embedded computing like devices within the existing internet infrastructure.” The increased demand for connected and smart devices requires additional bandwidth for ease of data transmission and accessibility. Isola has engineered its high-speed digital materials to support the foundation of the IoT. Isola laminates provide for ease in processing, stable electrical properties (Dk and Df) and thermal reliability.
- Multiple resin systems: High Tg, lead free, high speed digital, RF, halogen free
- Standard glass styles
- Square weave and spread glass
- Sequential lamination
- Hybrid processing
- Internet infrastructure
- Edge routers
- Core routers
Webinars, Videos & Articles
This paper discusses how the use of heavy copper in printed circuit boards for high voltage applications is on the rise in the automotive and power management systems industries.
This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.
This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.
This presentation discusses thermal management considerations for embedded systems.
This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.
This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.
This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.
This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.
This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.
This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.
This presentation discusses challenges and opportunities for halogen-free laminates.
This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.
This application note addresses the mechanical issues of this technology, when it is used on thicker boards.