P25N

Polyimide-based No Flow Prepreg

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
250°C
Td
383°C
Dk
3.67
Df
0.0187
IPC-4101 - /41
UL - File Number E41625
Isola offers a P25N product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.

These products consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset
polyimides.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Halogen free
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
  • Copper Foil Type
  • Copper Weight
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC250°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss383°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    60Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    55
    TBD
    --
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 500 MHz
    C. @ 1 GHz
    D. @ 2 GHz
    3.75
    3.72
    3.70
    3.67
    2.5.5.9
    2.5.5.9
    2.5.5.9
    Bereskin Stripline
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 500 MHz
    C. @ 1 GHz
    D. @ 2 GHz
    0.0140
    0.0157
    0.0180
    0.0198
    2.5.5.9
    2.5.5.9
    2.5.5.9
    Bereskin Stripline
    Volume Resistivity
    A. After moisture resistance
    B. At elevated temperature
    3.0 x 108
    7.0 x 108
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. After moisture resistance
    B. At elevated temperature
    3.0 x 106
    2.0 x 108
    2.5.17.1
    Dielectric Breakdown>55kV2.5.6B
    Arc Resistance130Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)4 (100-174)Class (Volts)UL 746A
    ASTM D3638
    Flexural Strength
    A. Length direction
    B. Cross direction
    83,600
    55,500
    2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    55,030
    35,370
    ASTM D3039
    Moisture Absorption0.5%2.6.2.1A
    Flammability (Laminate & laminated prepreg)HBRatingUL 94
    Max Operating Temperature140°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    04/18/2017
    Prepreg Data Sheet
    10/20/2014
    Material Safety Data Sheet
    12/31/2015
    RoHS Declaration
    08/21/2013
    Processing Guide

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