TerraGreen®

Halogen-free, Very Low Loss Material

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
200°C
Td
390°C
Dk
3.44
Df
0.0039
IPC-4103 - /17
UL - File Number E41625
TerraGreen® laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

TerraGreen® is engineered for such highperformance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz.

TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.

TerraGreen® meets UL 94 V-0 and is halogen free.

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • VLP-2 (2 micron), 1 oz and below
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC200°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss390°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    60Minutes2.4.24.1
    Z-Axis CTE50 to 260°C, (Total Expansion)2.9%2.4.24C
    X/Y-Axis CTEPre-Tg16ppm/°C2.4.24C
    Thermal Conductivity0.32W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 2 GHz
    B. @ 5 GHz
    C. @ 10 GHz
    3.442.5.5.5
    Df, Loss Tangent
    A. @ 2 GHz
    B. @ 5 GHz
    C. @ 10 GHz
    0.0039Bereskin Stripline
    Volume ResistivityC-96/35/901.33 x 107MΩ-cm2.5.17.1
    Surface ResistivityC-96/35/901.33 x 1052.5.17.1
    Dielectric Breakdown45.4kV2.5.6B
    Arc Resistance139Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)In TestingClass (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. 0.5 oz. EDC foil
    B. 1 oz. EDC foil

    0.88 (5.0)
    N/mm (lb/inch)2.4.8C
    Flexural Strength
    A. Length direction
    B. Cross direction
    75,500
    60,000
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    40,000
    39,000
    ksiASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.238
    0.231
    ASTM D3039
    Moisture Absorption0.5%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    02/23/2017
    Dk/Df Construction Table
    04/18/2017
    Laminate Data Sheet
    09/23/2013
    Processing Guide

    Webinars, Videos & Articles

    High Tg Bromine-free Laminates for PWB Applications (Technical Paper)

    This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

    Halogen Free Base Materials for PWB Applications (Technical Paper)

    This paper discusses the challenges and concerns of commercially-available non-halogen materials.

    Meeting Flame Resistance Requirements for Green Electronics (Presentation)

    This presentation discusses challenges and opportunities for halogen-free laminates.

    Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

    This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

    If you have any questions about TerraGreen, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in TerraGreen.

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