Technical papers

Stack-up and routing optimization by understanding micro-scale PCB effects (Technical Paper)
This paper presents an experimental, numerical, and analytical investigation of the important role that micro-scale PCB effects play in defining the characteristic impedance of interconnects, the associated attenuation and phase constant, and the appearance of resonances in the insertion and return loss.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs (White Paper)
This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Fire Retardancy What, Why and How (White Paper)

The paper takes a critical look at all aspects of fire retardancy, starting with the need for fire safety.

Utilizing Thermal Fatigue Testing to Differentiate the Performance of Epoxy Materials at Various Glass Transition Temperature Levels (Technical Paper)
This paper discusses Interconnect Stress Testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect.

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing (Technical Paper)
This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.

The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards (Technical Paper)
This paper shows how small sets of designed experiments can be used to create a compensation model.

Standardizing a Test Method for Conductive Anodic Filament Growth Failure (Technical Paper)
This paper discusses a standard test vehicle design and test method, CAF analysis and board manufacturing.

Roughness Characterization for Interconnect Analysis (Technical Paper)
This paper discusses the electrical characterization of roughness effect for analysis of digital and microwave signal propagation in rough PCB interconnects.

Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance (Technical Paper)
This paper discusses the continuing evolution of FR-4 base materials.

Process-specific PCB Thickness Modeling (Technical Paper)
This paper discusses a method to design a thickness prediction model for a specific board shop process.

Predicting Dimensional Deformation During Lamination for Multilayer Printed Circuit Boards (Technical Paper)
This paper describes a model that helps predict the dimensional movement as a function of CTE’s and moduli of the constituent layers and as a function of the lamination temperature.

PCB Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements (Technical Paper)
This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates (Technical Paper)
This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

Moisture Absorption Properties of Laminates Used in Chip Packaging Applications (Technical Paper)
This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.

Micro-sectioning of Laminates (Technical Paper)
This paper describes how micro-sectioning can be an extremely useful technique to inspect PCBs.

Making Sense of Laminate Dielectric Properties (Technical Paper)
This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

Lead Free Assembly: A Practical Tool For Laminate Materials Selection (Technical Paper)
This paper defines a “best practice” methodology to be used in determining selection criteria for lead-free assembly materials.

Laminate Materials with Low Dielectric Properties (Technical Paper)
This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Laminate Materials for No-Lead Solder Applications (Technical Paper)
This paper discusses the development of resin systems that withstand the higher reflow temperatures required of lead-free solders, while offering ease of fabrication processing and providing cost competitive solutions in today’s global marketplace.

Signal Integrity Analysis Techniques Used to Characterize PCB Substrates (Technical Paper)
This paper explores several methods used characterize PCB substrate electrical performance.

Improved High Speed, Low Loss Materials for Lead-Free Assembly Compatibility (Technical Paper)
This paper comparesa the properties of a low Dk, low Df material with an existing low Dk, low Df material in widespread use.

High Tg Bromine-free Laminates for PWB Applications (Technical Paper)
This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

Halogen Free Base Materials for PWB Applications (Technical Paper)
This paper discusses the challenges and concerns of commercially-available non-halogen materials.

Control of Key Registration Variables for Improved Process Yields on Dense MLBs (Technical Paper)
This paper explains the sources of registration error and outlines a path for improving process yield.

Conductive Anodic Filament Growth Failure (Technical Paper)
This paper provides describes Isola’s work in finding the right combination of process and design conditions for improved CAF resistant products.

COATED COPPER FOILS FOR HIGH DENSITY INTERCONNECTS (Technical Paper)
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Characterizing Geometry-Dependent Crossover Frequency for Stripline Dielectric and Metal Losses (Technical Paper)
This paper discusses how digital signaling requires interconnects operating at microwave frequencies to achieve current data transfer demands in computing platforms.

Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis (Technical Paper)
This paper will discuss how certain statistical analysis techniques may be used to decipher the results, and predict capabilities of PCB materials and/or processes.

New Developments in High Frequency Dielectric Measurements of PWB Materials Part II: Applications of the Bereskin Method to PWB Materials (Technical Paper)
This paper discusses how a relatively easy and repeatable technique is presented for measuring the Dielectric Constant and Dissipation Factor (Dk/Df) of PWB materials for frequencies in the range of 1.5 GHz to 12 GHz.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions (Technical Paper)
This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability (Technical Paper)
This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

A High Power GaN-HEMT Power Amplifier at 2.4 GHz (Technical Paper)
This paper presents the design, implementation and measurement of a high efficient GaN-HEMT power amplifier working at 2.4 GHz.