IS415 High Thermal Performance Epoxy Material Processing Guide Isola 062020
25 June 2020
Embedded Computing Blog: PCB laminate considerations for 4G-based M2M designs
Isola’s IS350MD Featured in Embedded Computing Blog Rich Nass, Brand Director at Embedded Computing discusses IS350MD in his latest blog titled, “PCB laminate considerations for 4G-based M2M designs.” Read the blog here.
No/Low Flow Resin Systems for Adhesive Applications
Isola offers several proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.prepreg. A11 and FR406N are epoxy resin systems. A11 features a Tg of 100°C as is suitable for standard applications.
Isola to Present at the IPC Technology Market Research Conference
Isola to Present at the IPC Technology Market Research Conference The TMRC is the electronics industry’s premier event on technology and market trends for decision makers. CHANDLER, Ariz., August 28, 2013 — Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials…