Boards, Chips and Packaging IMPACT Conference – October 13, 2015
Registration Opens for Inaugural Boards, Chips and Packaging IMPACT Conference Hosted by Isola and Semico Research
Airline Captain Chesley B. “Sully” Sullenberger, III to deliver a keynote address during this one-day event that is focused on system-level integration across the entire hardware development process.
CHANDLER, Ariz., July 8, 2015— Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced today that they have teamed up to launch Boards, Chips and Packaging: Designing to Maximize Results. This new industry event will span the system-level ecosystem to address the roles of system architecture, board design, chip design, package design and final fabrication and assembly processes for hardware product development. Conducted under the auspices of Semico’s highly regarded and respected IMPACT Conference series, this one-day conference will take place on October 13, 2015 at the Computer History Museum in Mountain View, California.
Among the keynote speakers of the event will be Captain Chesley B. “Sully” Sullenberger, III., best known for serving as the Captain during what has been called the “Miracle on the Hudson,” Captain Sullenberger has become known for his expertise in safety and knowledge of improvements of high-performance systems to save lives, save money and bring value to communities.
For years, software has been viewed as providing the most “value-add” for electronic products; however, without a solid foundation of properly functioning hardware, the reliability of the software is secondary. As such, all phases of the overall hardware development process need to be addressed at a higher level—and with greater emphasis—as part of the whole product development cycle. This event is targeted toward PCB designers, system architects, chip designers, package designers, program managers and marketing executives involved in system-level, ecosystem decisions.
Jim Feldhan, President for Semico Research stated, “From the hardware development perspective, companies are faced with the requirements of meeting ever-increasing market demands for lower power, higher performance and lower costs. While chips may meet system specifications, complex designs require even more attention at the board, packaging, manufacturing and assembly levels to deliver products that not only work right the first time but are also reliable across the entire product life cycle. In order to develop and bring these life-enhancement products to market, it is necessary to start with a firm foundation, and that is where Isola comes into play. Its history as a premier materials science company, along with the quality of its laminate materials, makes Isola an optimal partner for this conference.”
In addition, Feldhan noted, “There is no one conference that is dedicated to the hardware side of the product development process. That is one of the key reasons that we are launching this event at this point in time.”
Tarun Amla, Executive Vice President and Chief Technology Officer at Isola Group noted, “Today’s technology affects all facets of consumer lifestyles. The electronics industry is undergoing a major metamorphosis in terms of how consumers influence next-generation product features and delivery requirements. Gone are the days of shouting at consumers, telling them what they need. Now we must listen to the markets and design around their needs. This event will bring the industry together to ensure the consumers’ voices are heard to deliver the most feature rich, compact and affordable devices to market by sharing best practices and engaging at all levels of the design cycle.”
Boards, Chips and Packaging: Designing to Maximize Results will cover a variety of industry topics such as How Can Board Companies, Chip Companies and Fabrication Companies Work Together to Ensure That Hardware Products Are Right the First Time; How Do We Get to 32Gb/S and Beyond; The Role of mm-Wave Automotive RADAR; Phased Array RADAR Antenna Solutions and RF/Digital Hybrid Boards.
For information on sponsorships and speaking opportunities, please contact Jim Feldhan from Semico Research at 602-997-0337, Opt#1, firstname.lastname@example.org or Joanne Itow from Semico Research at 602-997-0337, Opt#2, email@example.com.
To learn more about the Boards, Chips and Packaging: Designing to Maximize Results conference and to register for the event, please visit http://www.semico.com/events.