Webinar: Selecting Materials for RF/Microwave/Millimeter-wave Designs
PCB Material Selection for RF/Microwave/Millimeter-wave Design Webinar
The PCB market for RF, microwave and millimeter-wave applications is evolving. What once was primarily focused on military applications has grown to meet the needs of commercial applications having demanding cost and performance requirements. This has resulted in an increase in PCB product offerings, presenting the designer with the challenge of choosing the right material.
Selecting the appropriate PCB material for RF, microwave and millimeter-wave applications require consideration of cost constraints and system-performance parameters, including:
- The frequency of operation and bandwidth
- Electrical size of board and critical features
- Loss and uniformity requirements
- Temperature range of system operation
- Thermal and processing considerations
In these systems, the PCB contributes to system loss through dielectric loss, conductor loss and impedance mismatch. Dielectric loss is determined by PCB material’s constituents, while conductor loss is due to copper surface roughness and skin effects. Impedance mismatch is a result of inconsistencies in PCB material thickness or constitutive parameters. Through careful considerations of the system performance constraints and PCB material attributes, an appropriate choice can be made.
This webinar will describe various PCB material attributes and the material selection process, as it relates to advanced automotive safety systems.
- PCB Attributes for RF/microwave/millimeter-wave systems
- Application Example – Advanced Automotive Safety Systems
- Product Solutions
- Summary and Conclusions
Why this webcast is important:
This webinar describes PCB material parameters, their effect on system performance and the process for product selection. At the conclusion of the web seminar, the viewer should have a better understanding of PCB material selection for RF/microwave/millimeter-wave systems, a fundamental part of the system design and development process.