A Lab For Glass Skew Glass Stop & Other PCB Design Challenges
24 February 2016
Isola Issues Cease and Desist Notification, Files for Injunction in R.O.C. Against TUC
CHANDLER, ARIZONA, September 16, 2008 – Isola USA Corporation (“Isola”), demanded that TUC respect the R.O.C. invention patent No. 123529 entitled “Fillers for Improved Epoxy Laminates” immediately cease all acts that would infringe on the patent, including but not limited to manufacturing the products with…
No/Low Flow Resin Systems for Adhesive Applications
Isola offers several proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.prepreg. A11 and FR406N are epoxy resin systems. A11 features a Tg of 100°C as is suitable for standard applications.
Isola participated in the Pan Pacific Microelectronics Symposium – SMTA, January 22-24, 2013 at the Makena Beach and Golf Resort in Maui, Hawaii. This event promoted international technical interchange and provided a premier forum for networking among microelectronics professionals and business leaders throughout the world.