Embedded Computing Blog PCB Laminate Considerations For 4G Based M2M Designs
08 March 2016
Video: Time to Delamination
Separation of the internal layers of a laminate or printed wiring board is commonly referred to as delamination. Caused by internal stress when the sample is exposed to heat, delamination results in a change in the sample dimension measurable by a Thermomechanical Anaylzer or…
Isola Analyzing the Impact of Recent Raw Material Increases
CHANDLER, ARIZONA, October 19, 2005 – Isola today announced that they are analyzing the impact of cost increases in various materials basic to the manufacture of laminate and prepreg products produced and sold in North America. “Recent increases in the prices of all hydrocarbon-based products…
Free-Space Technique for Measurement of PCB Laminate Materials
The April 2014 issue of Printed Circuit Design & Fab features an article titled, “Free-Space Technique for Measurement of PCB Laminate Materials,” written by Mike Miller, Sr. Manager, OEM Marketing at Isola. The article describes a simple, yet data rich, nondestructive method for material characterization.