Isola Expands Commercial Production of I-Speed® PCB Materials into Asia
Company also announces a price reduction of these low-loss, high-speed digital materials in the Asia-Pacific region
CHANDLER, Ariz., December 16, 2013 — Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced it had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.
Isola will manufacture I-Speed at its plant in Yangmei, Taiwan. This manufacturing facility is Isola’s flagship, high-speed digital manufacturing center. I-Speed will also continue to be manufactured at the company’s facility in Chandler, Arizona.
Ray Sharpe, President and CEO of Isola, commented, “In addition to reducing the cost of I-Speed in Asia, this transition will reduce lead times and enables our customers to be more responsive to the market."
I-Speed is a high-speed digital material engineered for PCB designs requiring more bandwidth than Isola’s FR408HR product. It has a glass transition temperature (Tg) of 180 degrees Celsius by differential scanning calorimeter (DSC) and a decomposition temperature of 356 degrees Celsius. I-Speed also delivers a 10 to 20 percent reduction in Z-axis expansion and a 15 to 25 percent improvement in dielectric loss compared to some of Isola’s existing products. I Speed provides best-in-class CAF resistance and comes standard with VLP-2, very-low profile copper with 2 µm surface roughness (Rz) copper foil. I-Speed is in the same UL family as the company’s IS415, FR408, and FR408HR products.
I-Speed’s attributes, new lower price and expanded availability make it an ideal product for OEMs demanding higher reliability and increased bandwidth for increasingly difficult designs. The product is ideal for internet infrastructure, cloud computing, telecommunication, military, aerospace, wireless and medical applications.